Canon Kabushiki Kaisha

Takuya Hatsui

Souta Takeuchi

Yoshiyuki Imanaka

Takahiro Matsui

Takaaki Yamaguchi

Kousuke Kubo

Teruo Ozaki

Kazuaki Shibata

Hirokazu Komuro

Satoshi Ibe

Ichiro Saito

Sakai Yokoyama

Muga Mochizuki

Toshiyasu Sakai

Yuzuru Ishida

Keisuke Kishimoto

Hiroto Komiyama

Sadayoshi Sakuma

Shimpei Otaka

Takeru Yasuda

Soichiro Nagamochi

Makoto Sakurai

Masataka Kato

Toru Nakakubo

Kazuhiro Asai

Masaya Uyama

Tomohiro Takahashi

Kenji Takahashi

Yoshiyuki Toge

Shinya Iwahashi

Jiro Moriyama

Kenjiro Watanabe

Keiichiro Tsukuda

Kimiyuki Hayasaki

Mineo Kaneko

Yoshinori Nakajima

Nobuyuki Hatasa

Masafumi Wataya

Kenji Ono

Shuichi Tamatsukuri

Masahiko Kubota

Mineo Shimotsusa

Hiroyuki Morimoto

Nobuyuki Hirayama

Masaki Oikawa

Hideo Tamura

Tatsuo Furukawa

Hiroshi Yamada

Hiraku Kozuka

Koichi Omata

Yukihiro Hayakawa

Souhei Tanaka

Yuji Tamaru

Ryoji Oohashi

Yoshihiro Hamada

Kei Fujita

Takashi Morii

A liquid ejection head is provided with a recording element substrate, and the recording element substrate includes an ejection port member, an electric wiring layer including a pressure generating element array and electric connection portions, and a silicon substrate including the ejection port member and the electric wiring layer on a front surface. The silicon substrate includes a first through hole and a second through hole that protrude the electric connection portions. The rear surface of the silicon substrate is a (100) surface. An extension line of a side extending along the [110] direction, out of sides of the opening of the first trough hole and an extension line of a side extending along the [110] direction, out of sides of the opening of the second through hole are displaced from each other in a direction orthogonal to the [110] direction.

Liquid ejection head

A liquid ejection head including an element substrate including an ejection port, an energy generating element generating energy to eject a liquid from the ejection port, and a terminal electrically connected to the energy generating element, and an electric connection member connected to the terminal and that supplies electric power to the energy generating element. The element substrate includes a hole portion drilled from a surface of the element substrate opposite a surface of the element substrate in which the ejection port is provided to the terminal. A sealing member is provided inside the hole portion, the sealing member covering a connection portion. The liquid ejection head further includes a fixing member in contact with the surface of the element substrate in which the ejection port is formed, the fixing member being provided at a position corresponding to the hole portion.

Liquid ejection head and method of manufacturing same

A liquid ejection head includes an ejection port member that includes an ejection port that ejects a liquid, an energy generating element that generates energy for ejecting the liquid from the ejection port, a terminal electrically connected to the energy generating element, and a substrate portion that supports the ejection port member, the energy generating element, and the terminal. The terminal is connected to a wire member that supplies electric power that drives the energy generating element to the energy generating element, the substrate portion includes a hole portion formed from a surface of the substrate portion on a side opposite to a surface of the substrate portion on which the terminal is provided to a surface where the terminal is exposed, and an area of the surface where the terminal is exposed is smaller than an area of an opening of the hole portion.

A semiconductor element includes an insulation layer and a pad portion for electrical connection to an external portion by wire bonding. The insulation layer includes a plurality of projections projecting from a main surface of the insulation layer. The pad portion is disposed on an upper surface of each of the projections without extending beyond the upper surface of the projection on which the pad portion is formed.

Semiconductor element, recording element substrate, and liquid discharge head

A liquid ejection head including a substrate, an energy generating element provided on the substrate, a film provided on the substrate and the energy generating element, and a flow path forming member provided on the substrate, forming a flow path of a liquid between the flow path forming member and the substrate, and having an ejection orifice at a position faced with the energy generating element, characterized in that the substrate has a supply path of the liquid communicating with the flow path, the flow path forming member has a structure protruding toward the supply path, and a peripheral shape of a distal end portion of the structure is a curved surface shape.

Liquid ejection head and manufacturing method thereof

A liquid ejection head, including: a flow path forming member including a resin layer having an ejection orifice and a flow path formed therein; a substrate including a heat-generating resistance element for ejecting liquid and a protective layer having a portion for covering the heat-generating resistance element, a surface of the portion being exposed to the flow path; and an intermediate layer formed between the resin layer and the protective layer, the intermediate layer including a silicon carbonitride material.

Liquid ejection head and liquid ejection device, and aging treatment method and initial setup method for a liquid ejection device

A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

Method for manufacturing liquid ejection head substrate

Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.

Substrate for ink jet recording head

An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.

Element substrate and method for discharging liquid

A method for manufacturing a liquid ejection head includes the following processes in the following order: forming a first metal layer containing a first metal material on an insulating layer of a base on which a plurality of thermal energy generating elements and the insulating layer are laminated in this order; forming a second metal layer containing a second metal material on the first metal layer, and then patterning the second metal layer to form a plurality of protective portions; patterning the first metal layer to form a connection portion for electrically connecting the plurality of protective portions; inspecting the conduction of the connection portion and the plurality of energy generating elements; and patterning the connection portion to thereby electrically isolate the plurality of protective portions and form a plurality of close contact portions which are electrically isolated from each other.

Method for manufacturing liquid ejection head

There are provided a substrate for an inkjet head, an inkjet head, and an inkjet printing apparatus wherein in a case where current is carried through a protection layer for heating resistors, electrical connection to its periphery is prevented without fail. The substrate for the inkjet head includes a first protection layer disposed to cover a heating resistor layer and having an insulation property and a second protection layer disposed to contact the first protection layer and having conductivity. The second protection layer includes a plurality of individual sections provided to correspond to the plurality of heating resistors, a common section connecting the plurality of individual sections, and fuse sections connecting the individual sections and the common section, the fuse sections being formed to be thinner than the individual sections.

Substrate for inkjet head, inkjet head, and inkjet printing apparatus

A substrate for an inkjet print head comprises: a base; a plurality of heating resistors for heating ink, the heating resistors being disposed on the base and producing heat in a case where the heating resistors are energized; a first protection layer disposed on the heating resistors and having insulation properties; and a second protection layer disposed on the first protection layer and having conductivity. The second protection layer includes individual sections disposed to individually cover the plurality of heating resistors, a common section connecting the individual sections, and connection sections interposed between the individual sections and the common section and connecting the individual sections and the common section. The connection sections are disposed at positions to be in contact with ink, and include a material which changes to an insulating film by an electrochemical reaction with the ink.

Substrate for inkjet print head, inkjet print head, method for manufacturing inkjet print head, and inkjet printing apparatus

There are provided a substrate for an inkjet head and an inkjet head wherein in a case where a protection layer of heating resistors is energized, an electrical connection with portions around the protection layer is more reliably cut. A first protection layer provided for the substrate for an inkjet head includes individual sections provided at positions corresponding to the plurality of heating resistors and a common section which commonly connects the plurality of individual sections. The individual sections and the common section are connected via connect sections which are eluted and connect in a case where an electrochemical reaction occurs between the connect sections and ink when electricity flow therethrough, so that an electrical connection between the individual sections and the common section is cut.

Substrate for inkjet head and inkjet head having protection layer including individual sections corresponding to heating resistors

The invention provides a liquid ejection head including a member in which an ejection orifice for ejecting a liquid is formed, and a substrate to which the member is joined. The substrate has a heat storage layer containing a silicon compound and an energy-generating element provided at a position corresponding to the ejection orifice for generating heat by electrification to eject the liquid from the ejection orifice. The energy-generating element has a laminate having a metal layer formed of tantalum or tungsten, an Si layer laminated on the metal layer and formed of silicon and an N layer laminated on the Si layer and formed of nitrogen, and the metal layer is in contact with the heat storage layer.

Process for producing liquid ejection head and process for producing substrate for liquid ejection head including repeated metal layer, Si layer, N layer laminations

When protective portions are independently provided for each energy generation element, a leakage current inspection between the protective portions and the energy generation elements cannot be performed at once. Therefore, there is a concern that the inspection in manufacturing a substrate for liquid ejection head requires time. Therefore, the substrate for liquid ejection head is manufactured by performing a leakage current inspection between a connecting portion that is electrically connected to plurality of protective portions and a terminal to which the plurality of energy generation elements are connected, and thereafter removing the connecting portion.

Method for manufacturing substrate for liquid ejection head and method for manufacturing liquid ejection head

Growing community of inventors

Tokyo, Japan

Takuya Hatsui