Fujitsu Corporation

Eudyna Devices Inc.

Sumitomo Electric Device Innovations, Inc.

Fujitsu Quantum Devices Limited

Other

Sumitomo Electric Industries, Limited

Takuya Fujii

Takayuki Watanabe

Hirohiko Kobayashi

Mitsuru Ekawa

Taro Hasegawa

Tsuyoshi Yamamoto

Haruhisa Soda

Tsutomu Ishikawa

Tsutomu Michitsuta

Haruhiko Tabuchi

Shouichi Ogita

Nirou Okazaki

Toshimitsu Kaneko

Yoshihiro Yoneda

Manabu Matsuda

Akinori Hayakawa

Hajime Shoji

Nami Yasuoka

Masao Makiuchi

Yuji Kotaki

Toshio Higashi

Susumu Yamazaki

Masami Ishiura

Toshiyuki Taguchi

Tooru Uchida

Hiroaki Ito

Daisei Shoji

A process of forming a semiconductor optical device is disclosed. The semiconductor optical device provides a waveguide structure accompanied with a heater for varying a temperature of the waveguide structure. The process includes steps of: (a) forming a striped mask on a semiconductor substrate; (b) selectively growing a dummy layer on the semiconductor substrate; (c) removing the patterned mask; (d) burying the dummy layer by a supplemental layer; (e) exposing a portion of the dummy layer by etching a portion of the supplemental layer; (f) and removing the dummy layer by immersing the dummy layer within a solution that shows an etching rate for the dummy layer enough faster than an etching rate for the supplemental layer and the substrate so as to leave a void in a region the dummy layer had existed.

Process of forming epitaxial substrate and semiconductor optical device

A semiconductor light receiving device includes a substrate having an incident surface receiving light incident on the semiconductor light receiving device and a principal surface opposite to the incident surface; a first semiconductor layer disposed on the principal surface of the substrate, the first semiconductor layer defining one of a cathode region and an anode region; a light absorbing region disposed on the first semiconductor layer; and a second semiconductor layer disposed on the light absorbing region, the second semiconductor layer defining the other of the cathode region and the anode region and forming a junction with the light absorbing region. The light absorbing region includes a semiconductor layer having a conductivity type opposite to the conductivity type of the first semiconductor layer. The semiconductor layer of the light absorbing region forms a p-n junction with the first semiconductor layer.

Semiconductor light receiving device and light receiving apparatus

A semiconductor laser has a first diffractive grating area. The first diffractive grating area has a plurality of segments. Each segment has a first area including a diffractive grating and a second area that is space area combined to the first area. Optical lengths of at least two of the second areas are different from each other. A refractive-index of each of the segments are changeable.

Wavelength tunable semiconductor laser having two difractive grating areas

An optical semiconductor device in which light having a wavelength of 1.25 &#x3bc;m or greater is waveguided, includes: a first waveguide of embedded type that includes a semiconductor and is lattice-matched with InP, the first waveguide having a region having a first constant width equal to or greater than 1.50 &#x3bc;m and a first region narrower than the region; and a second waveguide of embedded type that includes another semiconductor having a refractive index different from that of the first waveguide, the second waveguide having a region having a second constant width smaller than 1.50 &#x3bc;m and a second region wider than said region. The first waveguide and the second waveguide are joined at an intermediate waveguide portion. The intermediate waveguide portion includes the first region and the second region and a joining plane on which the first region and the second region are joined. The joining plane has a width equal to or smaller than 1.35 &#x3bc;m.

Optical semiconductor device

A first optical waveguide of a convex shape is formed over a substrate. A second optical waveguide of a convex shape is formed over the substrate. A multimode interference waveguide of a convex shape is formed over the substrate for optically coupling the first optical waveguide to the second optical waveguide. Either side of the first optical waveguide is filled with a filling material, but either side of the second optical waveguide is not filled with the filling material.

Optical waveguide device, its manufacture method, laser module and optical transmission system

A semiconductor laser has first and second diffractive grating regions. The first diffractive grating region has segments, has a gain, and has first discrete peaks of a reflection spectrum. The second diffractive grating region has segments combined to each other, and has second discrete peaks of a reflection spectrum. Each segment has a diffractive grating and a space region. Pitches of the diffractive grating are substantially equal to each other. A wavelength interval of the second discrete peaks is different from that of the first discrete peaks. A part of a given peak of the first discrete peaks is overlapped with that of the second discrete peaks when a relationship between the given peaks of the first discrete peaks and the second discrete peaks changes. A first segment located in the first diffractive grating region or the second diffractive grating region has an optical length shorter or longer than the other segments of the first diffractive grating region and the second diffractive grating region by odd multiple of half of the pitch of the diffractive grating of the first diffractive grating region.

Laser device, laser module, semiconductor laser and fabrication method of semiconductor laser

An optical semiconductor device includes a waveguide having one or more first segments having a region that includes a diffractive grating and another region combined to the region, one or more second segments having a region that includes a diffractive grating and another region combined to the region and a plurality of third segments having a region the includes a diffractive grating and another region combined to the region, a length of the second segment being different from that of the first segment, a length of the third segment being shown as L=L+(L&#x2212;L)&#xd7;Kin which 0.3&#x2266;K&#x2266;0.7, Lis a length of the first segment, Lis a length of the second segment and Lis a length of the third segment; and a refractive index control portion controlling refractive index of the first segment through the third segments.

Optical semiconductor device and method of controlling the same

A process of manufacturing a semiconductor device includes the steps of forming a stacked structure of a first III-V compound semiconductor layer containing In and having a composition different from InP and a second III-V compound semiconductor layer containing In. The second III-V compound semiconductor layer is formed over the first III-V compound semiconductor layer and growing an InP layer at regions adjacent the stacked structure to form a stepped structure of InP. The process further includes the step of wet-etching the stepped structure and the second III-V compound semiconductor layer using an etchant containing hydrochloric acid and acetic acid to remove at least the second III-V compound semiconductor layer.

Process of manufacturing a semiconductor device

An optical semiconductor device includes an optical semiconductor element, a metal pattern and at least one thermal conductive material. The optical semiconductor element has a first optical waveguide region and a second optical waveguide region. The second optical waveguide region is optically coupled to the first optical waveguide region and has a heater for changing a refractive index of the second optical waveguide region. The metal pattern is provided on an area to be thermally coupled to a temperature control device. The thermal conductive material couples the metal pattern with an upper face of the first optical waveguide region of the optical semiconductor element. The thermal conductive material is electrically separated from the first optical waveguide region.

Optical semiconductor element and optical semiconductor device

An optical semiconductor device includes a wavelength-tunable semiconductor laser chip, a mount carrier, a first temperature sensor and a wire. The wavelength-tunable semiconductor laser chip has a first optical waveguide and a second optical waveguide. The second optical waveguide has a heater on a surface thereof and is optically coupled to the first optical waveguide. The mount carrier is for mounting the wavelength-tunable semiconductor laser chip, and has a first area arranged at a surface of the mount carrier of the first optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted. The first temperature sensor is mounted on the first area. The wire couples between the heater and a second area arranged at a surface of the mount carrier of the second optical waveguide side when the wavelength-tunable semiconductor laser chip is mounted.

Optical semiconductor device and controlling method of the same

A method of manufacturing a semiconductor device, including the steps of (a) rowing an InP layer on a surface of starting growth, resulting in the InP layer having a convex structure, and (b) wet etching the InP layer by an enchant including hydrochloric acid and acetic acid, and thereby flattening a surface of the InP layer.

Method of manufacturing semiconductor device and method of manufacturing optical wave guide

Growing community of inventors

Yamanashi, Japan

Takuya Fujii