Nitto-denko Corporation

Takuya Eto

Kazuhiro Ikemura

Eiji Toyoda

Shinya Akizuki

Takahiro Uchida

Hisataka Ito

Tsutomu Nishioka

Keisuke Yoshikawa

Katsumi Shimada

Daisuke Tsukahara

Tsuyoshi Ishizaka

Katsuyuki Nakabayashi

Takeshi Okada

Kei Toyota

An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 &#x3bc;m or more are substantially not contained in the aforementioned epoxy resin composition.

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230&#xb0; C., and then mixing the component (A) and remaining components with the resulting mixture.

Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby

An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same

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Ibaraki, Japan

Takuya Eto