Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Powdered Metals Co., Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi-high-technologies Corporation

Panasonic Holdings Corporation

Panasonic Corporation

Resonac Corporation

Takuya Aoyagi

Takashi Naito

Shinichi Tachizono

Yuji Hashiba

Kei Yoshimura

Tadashi Fujieda

Tatsuya Miyake

Motomune Kodama

Yuichi Sawai

Masanori Miyagi

Hiroki Yamamoto

Taigo Onodera

Hajime Murakami

Takahiko Kato

Akihiro Miyauchi

Takashi Naitou

Takeshi Tsukamoto

Hiroshi Yoshida

Mutsuhiro Mori

Masahiko Ogino

Masato Yoshida

Satoru Amou

Takeshi Nojiri

Shinji Yamada

Hiroshi Onuki

Daisuke Terada

Mitsunori Iwamuro

Keiko Kizawa

Keiichi Kanazawa

Shinichi Kato

Hiroshi Nakano

Hitoshi Suzuki

Hiroyuki Ito

Tomio Iwasaki

Haruo Akahoshi

Seiji Miura

Hiroshi Hozoji

Seiichi Watanabe

Motoo Aoyama

Takeshi Kondo

Toshiaki Morita

Akitoyo Konno

Nobutake Tsuyuno

Hiroki Kaneko

Hisaya Murakoshi

Junichi Sakano

Eiichi Ide

Kenji Tanimoto

Kazutaka Okamoto

Shigeru Kikuchi

Norihisa Iwasaki

Hiroshi Kanemoto

Shigenobu Komatsu

Shuichiro Adachi

Takashi Ichimura

Mizuki Shibata

Tsuneyuki Hashimoto

Yuuichi Sawai

Akihito Iwai

Takashi Nogawa

Takahiro Ikabata

Shuuichirou Adachi

Ryou Ishibashi

Kiyomi Nakamura

Katsuhito Takahashi

Toshinori Kawamura

Tetsushi Hino

Eiichi Ogiwara

Norihito Sakaguchi

Kazuki Aoshima

Kenji Ohkubo

Shuichirou Adachi

The preset invention has as its object the provision of a laminate free of hexavalent chromium and excellent in corrosion resistance and wear resistance, and a manufacturing process of the laminate. To solve the above-described problems, a laminate according to the present invention includes a substrate, and a laminated film portion with metal films laminated in two or more layers. The laminate has an interface layer between each two adjacent ones of the metal films. The laminated film portion contains a first metal element as a principal component, the first metal element being at least one element of Ni, Cr, Co, and W, and a second metal element that is a metal element of smaller cohesive energy than that of the first metal element. The second metal element contained in the interface layer is at a content ratio higher than that of the second metal element contained in each of the adjacent metal films.

Laminate, metal plating solution, and manufacturing process of laminate

There is provided a gas trapping material and vacuum heat insulation equipment where the gas trapping material can be activated in a sealing step of the vacuum heat insulation equipment, and production efficiency can be enhanced by maintaining a high gas trapping characteristic even when a gas is released in a baking step or in a sealing step under an air atmosphere. The gas trapping material contains porous metal oxide and silver particles having an average particle size of 0.5 nm to 100 nm inclusive.

Gas trapping member and vacuum heat insulation equipment

A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

Pressure detection device with noise resistant pressure sensor

The purpose of the present invention is to provide a lead-free glass composition in which crystallization is suppressed and which has a low softening point. This lead-free glass composition is characterized by containing silver oxide, tellurium oxide and vanadium oxide, and further containing at least one compound selected from among yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, gallium oxide, indium oxide, iron oxide, tungsten oxide and molybdenum oxide as an additional component, and in that the content values (mol %) of silver oxide, tellurium oxide and vanadium oxide satisfy the relationships AgO&#x3e;TeO&#x2265;VOand AgO&#x2264;2VOwhen calculated in terms of the oxides, and in that the content of TeOis 25-37 mol. %.

Lead-free glass composition, glass composite material, glass paste, sealing structure, electrical/electronic component and coated component

Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass. A thermal expansion coefficient of the first bonding layer is equal to or lower than a thermal expansion coefficient of the second bonding layer, a softening point of the second bonding layer is equal to or lower than a heat resistant temperature of the semiconductor chip, and a softening point of the first bonding layer is equal to or lower than the softening point of the second bonding layer.

Physical quantity measurement device, method for manufacturing same, and physical quantity measurement element

It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390&#xb0; C. or less. And, connection resistance between the joined members exhibits less than 1&#xd7;10&#x3a9;/mm.

Conductive joint article and method for manufacturing same

The purpose of the present invention is to provide a joining material that can easily join materials to be joined even when characteristics and physical properties thereof differ greatly. To solve the above problem, the joining material according to the present invention is characterized by including a base material, a first layer that is disposed on one surface of the base material, and a second layer that is disposed on the other surface of the base material and includes a phase having a different coefficient of thermal expansion to that of the phase configuring the first layer, at least one of the first and second layers including glass having a softening point of 600&#xb0; C. or lower.

Joining material and joined body using same

A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.

Sealed structural body and method for manufacturing the same

There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: VO+BaO+PO+WO&#x2265;90 and VO&#x3e;BaO&#x3e;PO&#x3e;WO(wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.

Heat-insulating member, low-melting glass composition, and sealing material paste

An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20&#xb0; C. higher than a flow point of the glass composition.

Multi-layer glass and method for producing the same

The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least AgO, VOand TeOwhen the components are represented by oxides, wherein the total content ratio of AgO, VOand TeOis 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of AgO, 5 to 65 mass % of VO, and 15 to 50 mass % of TeO.

Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same

A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

Heat-dissipating structure and semiconductor module using same

The purpose of the present invention is to provide a charged particle beam device that exhibits high performance due to the use of vanadium glass coatings, and to provide a method of manufacturing a component for a charged particle beam device. Specifically provided is a charged particle beam device using a vacuum component characterized by comprising a metal container, the interior space of which is evacuated to form a high vacuum, and coating layers formed on the surface on the interior space-side of the metal container, wherein the coating layers are vanadium-containing glass, which is to say an amorphous substance. Coating vanadium glass onto walls of a space where it is desirable to form a high vacuum, for example walls in the vicinity of an electron source, reduces gas discharge in the vicinity of the electron source, and the getter effect of the coating layer induces localized evacuation and enables the formation of an extremely high vacuum, even in spaces having a complex structure, without providing a large high-vacuum pump.

Charged particle beam device, and method of manufacturing component for charged particle beam device

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2265;90 (mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

Electronic component, method for producing same, and sealing material paste used in same

An AgO&#x2014;VO&#x2014;TeOlead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WOand PO; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of VO, TOand AgO. Contents of TeOand AgO each is 1 to 2 times as much as a content of VO. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same

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Tokyo, Japan

Takuya Aoyagi