Yokowo Co., Ltd.

Takuto Yoshida

Atsushi Sato

Wasuke Yanagisawa

Yasuo Fukushima

Mitsuhiro Suzuki

Ryo Horie

Masaki Noguchi

Makoto Nakakoji

Alvy V Padiyil

A support block is provided with a plurality of through holes for supporting probes. The probes for signals, for power supply and for grounding are secured in the through holes of the support block and electrically interconnect electrode terminals of a device to be inspected, which is provided on one face side of the support block, and wiring terminals connected to an inspection unit, which is provided on the other face side of the support block. A device guide is integrally formed with or separately fixed to the one face side of the support block, and includes an opening having a square shape in a plan view for guiding the device to be inspected. A centering mechanism adjusts a position of the device to be inspected at a center position of the opening of the device guide.

Socket for inspection

A support block has a first face, a second face opposed to the first face, and first and second through holes communicating between the first face and the second face, and is formed with resin material. The first face, the second face, and the first and second through holes are covered with an electrically conductive plated coating. First and second probes are electrically connected to terminals of a device to be tested provided on a side of the first face and to terminals connected to a testing apparatus provided on a side of the second face. The first probe is provided in the first through hole and is electrically connected to the plated coating on the first through hole, the second probe is provided in the second through hole and is electrically connected to the plated coating on the second through hole. A pattern for defining a first region electrically connected to the first probe via the plated coating and a second region electrically connected to the second probe via the plated coating is formed by partially removing the plated coating on the first face and the second face, where the second region is electrically isolated from the first region. Electrodes of an electronic component are respectively connected to the first and second regions.

Test socket

An insulative block has a first face adapted to oppose a board on which an inspection circuit is arranged and a second face adapted to oppose a device to be inspected. The insulative block is formed with first through holes each of which communicates the first face and the second face. A conductive first plating layer is formed on the first face, the second face, and an inner face of at least one of the first through holes. Each of contact probes includes a conductive tubular body held in an associated one of the first through holes and a plunger which is retractably projected from one end of the tubular body and is adapted to come in contact with a terminal of the device.

Inspection unit

A conductive block is formed with a first face, a second face and a through hole connecting the first face and the second face. A contact probe is provided with a conductive pipe and a conductive plunger, retractably provided in at a first end of the pipe, the plunger being to be brought into contact with a device to be inspected. A first retainer includes a first insulative member through which the first end of the pipe is retained in the vicinity of the first face of the block, such that the pipe is coaxially held within the through hole while forming a gap between an outer periphery of the pipe and an interior wall of the through hole.

Inspection coaxial probe and inspection unit incorporating the same

An insulative block has a first face adapted to oppose a board on which an inspection circuit is arranged and a second face adapted to oppose a device to be inspected. The insulative block is formed with through holes each of which communicates the first face and the second face. A conductive plating layer is formed on the first face, the second face, and an inner face of at least one of the through holes. Each of contact probes includes a conductive tubular body held in an associated one of the through holes and a plunger which is retractably projected from one end of the tubular body and is adapted to come in contact with a terminal of the device. The contact probes includes a first group of contact probes adapted to come in contact with terminals of a first circuit in the device, and a second group of contact probes adapted to come in contact with terminals of a second circuit in the device. The plating layer is divided by a groove into a first region including the first group of the contact probes and a second region including the second group of the contact probes, so that the first region and the second region are electrically insulated from one another.

Inspection unit for high frequency/high speed device connections

A conductive member having a first face adapted to be mounted on a board on which an inspection circuit is arranged, and a second face adapted to be opposed to a device to be inspected is prepared. The conductive member is formed with a first through hole having a first diameter and communicating the first face with the second face. A contact probe including a tubular body having a second diameter which is smaller than the first diameter, and a plunger retractably projected from one end portion of the tubular body is prepared and disposed in the first through hole. A conductive plate having a second through hole is prepared. Molten resin is injected into the second through hole such that at least a part of inner face of the second through hole is covered with solidified resin, thereby forming a third through hole. The conductive plate is disposed so as to oppose to the second face of the conductive member and to communicate the third through hole with the first through hole. The solidified resin is brought into contact with at least the one end portion of the tubular body so as to coaxially retain the contact probe in the first through hole while only the plunger is projected from the conductive plate.

Method of manufacturing inspection unit

A plurality of probes such as a signal probe () and a power supply probe () are provided into a metal block () so as to penetrate. Each of the probes has a movable pin (). A tip of the movable pin is projecting from one surface of the metal block (). And a projection length of the tip is variable. A DUTis pressed onto the surface of the metal block () to contact between electrode terminals (to) and tips of the probes to test characteristics of the DUT. At least one of the probes is capacity loaded probe having a capacitor by providing a dielectric layer and a metal film to peripheral of the probe. As a result, noise can be removed reliably. Additionally, when the capacity loaded probe is used as the power supply probe, a voltage drop is reduced at the power supply terminal in a case of change of the output.

Capacity load type probe, and test jig using the same

A conductive member has a first face adapted to be mounted on a board on which an inspection circuit is arranged and a second face adapted to be opposed to a device to be inspected. The conductive member being formed with a first through hole having a first diameter and communicating the first face with the second face. A contact probe is provided with a tubular body having a second diameter which is smaller than the first diameter, and a plunger retractably projected from one end of the tubular body. A first retainer is formed with a second through hole and opposing at least the second face of the conductive member so as to communicate the first through hole with the second through hole, so that the contact probe is retained in the conductive member while only the plunger is projected from one end of the second through hole. A second retainer is adapted to retain the one end of the tubular body concentrically with the first through hole.

A conductive member has a first face adapted to be mounted on a board on which an inspection circuit is arranged and a second face adapted to be opposed to a device to be inspected. The conductive member is formed with a plurality of first through holes having a first common diameter and communicating the first face with the second face. A first contact probe is provided with a first tubular body having a second diameter which is smaller than the first diameter, and a first plunger retractably projected from one end of the first tubular body. A second contact probe is provided with a second tubular body having a third diameter which is smaller than the second diameter, and a second plunger retractably projected from one end of the second tubular body. A retainer is formed with a plurality of second through holes having a common shape, and provided on at least the second face of the conductive member so as to communicate the first through holes with the second through holes, so that the first contact probe and the second contact probe are retained in the conductive member while only the first plunger and the second plunger are projected from one ends of the second through holes.

An IC socket receives an IC provided with arrayed terminals. In the IC socket, a conductive block is formed with a first face opposing to the received IC, and a plurality of holes arrayed in association with the terminals of the received IC. Each of a plurality of contact probes is disposed in each of the holes, and is provided with a conductive pipe, and a conductive plunger, retractably provided at a first end of the pipe, the plunger being to be brought into contact with an associated one of the terminals. A retainer provided with an insulative member through which the pipe is coaxially held within an associated one of the holes while forming a gap between an outer periphery of the pipe and an interior wall of the associated one of the holes. At least one of the contact probes to be brought into contact with an RF signal terminal among the terminals of the received IC is retained by the retainer.

Growing community of inventors

Tokyo, Japan

Takuto Yoshida