Hitachi Automotive Systems, Ltd.

Hitachi, Ltd.

Hitachi Metals, Ltd.

Takuto Yamaguchi

Osamu Ikeda

Shohei Hata

Hiromitsu Kuroda

Atsushi Kazama

Kisho Ashida

Masahide Okamoto

Hanae Shimokawa

Kazuma Kuroki

Kentarou Miyajima

Masayuki Hio

Atsuo Soma

Junji Onozuka

Hiroyuki Oota

Yuichi Oda

A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Mechanical quantity measuring device and sensor unit

The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (), Al-based metallic layers () on both sides thereof, and X-based metallic layers () (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Junction material, manufacturing method thereof, and manufacturing method of junction structure

The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin. Solder containing easily volatized metals (Zn, Mg, Sb) is used for a solder material, and after a semiconductor elementis connected to a lead frameand wire bonding is carried out, vacuum heat treatment is applied, the easily volatized metals in the solder are volatized to adhere to a substrate surface, and an alloywith the lead frame is formed, thereby roughening the substrate surface and improving the adhesive strength of a sealing resinand the substrate.

Semiconductor device and method for manufacturing same

An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal, among the large number of through holes, a land or a conductor film connected to the conductor film formed on the inner wall surface of the through hole or the conductor film not connected to the conductor film formed on the inner wall surface of the through hole, formed in the circuit board held between the top layer circuit board and the bottom layer circuit board, exists in a width equal to or wider than the diameter of the through hole.

Printed circuit board and electronic device using printed circuit board

Growing community of inventors

Tokyo, Japan

Takuto Yamaguchi