Asahi Kasei Kabushiki Kaisha

Asahi Kasei E-materials Corporation

Takuto Nakata

Junichi Yoshida

Masaaki Aramaki

Yoshimichi Mitamura

Katsuhiro Iwase

Norikiyo Nakagawa

Hiroshi Fukuoka

Miyuki Kazunori

Yutaka Tada

Tatsuro Toda

Shota Ide

Hisanari Yoneda

A methacrylic resin having a cyclic structure in a main chain thereof, a shaped article, and an optical component or automotive part, in which the glass transition temperature is higher than 120&#xb0; C. and 160&#xb0; C. or lower, and the sign of the orientational birefringence when being oriented so as to have a degree of orientation of 0.03 is different from the sign of the orientational birefringence when being oriented so as to have a degree of orientation of 0.08.

Methacrylic resin, shaped article, and optical component or automotive part

A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.

Heat-reactive resist material, mold manufacturing method, mold, development method and pattern formation material

In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof.

Copper oxide etchant and etching method using the same

To provide an etchant for copper oxide, control of the etching rate, and etching method using the same for enabling exposed portions to be selectively etched against unexposed portions in the case of performing exposure with laser light using an oxide of copper as a heat-reactive resist material, an etchant of the invention is an etchant for copper oxide to selectively remove a copper oxide of a particular valence from a copper oxide-containing layer containing copper oxides of different valences, and is characterized by containing at least an amino acid, a chelating agent and water, where a weight percentage of the amino acid is higher than that of the chelating agent, and pH thereof is 3.5 or more.

Etchant and etching method using the same

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Tokyo, Japan

Takuto Nakata