Jnc Corporation

Takuro Tanaka

Koji Ohguma

Mikio Yamahiro

Yuka Takahashi

Aki Kuromatsu

Kenya Ito

Yoshitaka Morimoto

Hiroyuki Iizuka

Yukio Hirano

Yasuhiko Nakagawa

A laminate body () is provided with a transparent substrate () and a refractive layer () which refracts incident light towards the top of the substrate (). The refractive layer () contains, at least, one kind of fluorine compound (ss) selected from a group consisting of fluoro-silsesquioxane and fluoro-silsesquioxane polymers, and a resin (pl) having a refractive index higher than that of the aforementioned fluorine compound (ss). Of the side of the substrate () (the side of the back surface s) and the side opposite thereof (the side of the front surface s), the concentration of the fluorine compound (ss) in the refractive layer () is higher on said side opposite (the side of the front surface s), and the refractive layer () forms a graded structure layer of high refractive indices and low refractive indices inside the layer.

Laminate body and manufacturing method thereof

Provided is a transparent conductive film having multilayer structure, and inconspicuous pattern shape and good visibility. The film includes: transparent baseformed of film-like polymer resin; first hard coat layerlaminated on the base; first transparent dielectric layerlaminated as required on the layer; and first transparent conductive layerlaminated on the layer. The basehas a film thickness of 2 to 250 micrometers. The layeris formed of hardening resin containing inorganic oxide, with refractive index: 1.40 to 1.90 and film thickness: 0.5 to 6 micrometers. The layeris formed of inorganic substance, with refractive index: 1.30 to 1.50 and film thickness: 10 to 50 nanometers. The layeris formed of at least one kind of inorganic oxide, metal and carbon, and patterned, and has a film thickness of 10 nanometers to 2 micrometers.

Transparent conductive film and method for producing same

The transparent electroconductive film is provided with: a transparent substrate formed from a film-shaped polymer resin; a first hard coat layer laminated on one surface of the substrate; and a first transparent conductor layer laminated on the upper side of the first hard coating layer. The substrate has a film thickness of 2 to 250 &#x3bc;m. The first hard coating layer is formed from a curable resin containing an inorganic oxide, and has a film thickness of 0.01 &#x3bc;m to less than 0.5 &#x3bc;m, or more than 6 &#x3bc;m to 10 &#x3bc;m. The first transparent conductor layer is formed from at least one material selected from the group consisting of an inorganic oxide, a metal, and carbon, has a film thickness of 10 nm to 2 &#x3bc;m, and is patterned so as to have formed thereon a patterned section and a non-patterned section.

Transparent electroconductive film

Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer () which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L). The transfer layer () comprises an IMD layer (L) laminated on the substrate (L) and to be arranged on the outermost surface of the molded body after the in-mold molding. The IMD layer (L) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.

Growing community of inventors

Chiba, Japan

Takuro Tanaka