Mitsubishi Electric Corporation

Takuro Shinada

Yutaka Yoneda

Akihiro Matsusue

Hiromitsu Itamoto

Haruki Koyanagi

A first conductive pattern () is provided on an upper surface of the submount (). A GND pattern () is provided on a lower surface of the submount (). A lower surface electrode () of a capacitor () is bonded to the first conductive pattern () with solder (). An upper surface electrode () of the capacitor () is connected to a light emitting device (). A terminating resistor () is connected to the first conductive pattern (). The first conductive pattern () has a protruding portion () which protrudes outside from the capacitor () in planar view. A width of the protruding portion () is narrower than a width of the capacitor ().

Optical semiconductor device

A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.

Optical module

Included are a metal block, a first sub-mount fixed to the metal block, and a second sub-mount having an upper surface and a lower surface which is fixed to the first sub-mount via a metal layer. Also included are an optical element mounted on the upper surface of the second sub-mount and a high frequency line path which is formed on the upper surface of the second sub-mount and electrically connected to the optical element so as to cause a signal such as a high-frequency signal to be input to or output from the optical element. In addition, the metal layer is electrically connected to the metal block.

Light module

An optical transmitting apparatus includes semiconductor laser elements. Upon receiving laser beams, a multiplexed beam is emitted from a wavelength multiplexing filter. The wavelength multiplexing filter includes a triangular prism and a wavelength multiplexing filter film. A front end face and a rear end face of the prism are not parallel to each other so that a prism angle at which a surface parallel to the front end face intersects a surface parallel to the rear end face, is an acute angle. The prism angle is the angle at which the laser beam impinging from the front end face into the triangular prism is reflected by the wavelength multiplexing filter film toward the front end face and the multiplexed beam is directed to the optical axis side of the optical fiber.

Growing community of inventors

Tokyo, Japan

Takuro Shinada