Mitsui Chemicals, Inc.

Takuo Tajima

Keisuke Takuma

Tatsuhiro Urakami

Koutaro Suzuki

Kenichi Sugimoto

Atsuo Otsuji

Tadahito Nobori

Usaji Takaki

Yoshiyuki Shindo

Kouzou Tanaka

An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) an at least bifunctional ester-containing compound and/or an at least bifunctional ester-containing resin as a curing agent, 10 to 100% of whose hydroxy groups are esterified with aliphatic or aromatic acyl groups, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1):

Epoxy-resin composition and use thereof

A polymaleimide resin composition is herein disclosed which comprises an aromatic amino resin, a polymaleimide resin and a bifunctional crosslinking agent as components, and the bifunctional crosslinking agent is selected from the group consisting of an aliphatic diamine compound, a 2,4-diamino-S-triazine compound, a diisocyanate compound, an aliphatic diamine compound and a bismaleimide compound; and a laminate plate for a semiconductor substrate in which the polymaleimide resin composition is used is also disclosed. The thermosetting resin composition permits the preparation of prepregs and green sheets having excellent flexibility, so that the workability and the productivity of the laminate plates can remarkably be improved.

Polymaleimide resin composition and laminate plate for semiconductor

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Kanagawa, Japan

Takuo Tajima