Hamamatsu-photonics K.k.

Takuo Koyama

Hirokazu Yamamoto

Katsumi Shibayama

Tomofumi Suzuki

Kyosuke Kotani

Tatsuya Sugimoto

Noburo Hosokawa

Yutaka Kuramoto

Masaharu Muramatsu

Yasuhito Yoneta

Shin-ichiro Takagi

Nao Inoue

Shinichi Nakata

A mirror unitincludes a mirror deviceincluding a baseand a movable mirror, an optical function member, and a fixed mirrorthat is disposed on a side opposite to the mirror devicewith respect to the optical function member. The mirror deviceis provided with a light passage portionthat constitutes a first portion of an optical path between the beam splitter unitand the fixed mirror. The optical function memberis provided with a light transmitting portionthat constitutes a second portion of the optical path between the beam splitter unitand the fixed mirror. A second surfaceof the baseand a third surfaceof the optical function memberare joined to each other.

Mirror unit and optical module

A mirror unitincludes a mirror deviceincluding a baseand a movable mirror, an optical function member, and a fixed mirrorthat is disposed on a side opposite to the mirror devicewith respect to the optical function member. The optical function memberis provided with a light transmitting portionthat constitutes a part of an optical path between the beam splitter unitand the fixed mirror. The light transmitting portionis a portion that corrects an optical path difference that occurs between an optical path between the beam splitter unitand the movable mirrorand the optical path between the beam splitter unitand the fixed mirror. The second surfaceof the baseand the third surfaceof the optical function memberare joined to each other.

A semiconductor device includes a support body including a mount region, a semiconductor chip disposed on the mount region with a predetermined distance therebetween, a bump disposed between the support body and the semiconductor chip, a wall portion disposed between the support body and the semiconductor chip along a part of an outer edge of the semiconductor chip, and an underfill resin layer disposed between the support body and the semiconductor chip. The underfill resin layer covers an outer side surface of the wall portion.

Semiconductor device and method for manufacturing semiconductor device

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Hamamatsu, Japan

Takuo Koyama