Fujitsu Corporation

Cypress Semiconductor Corporation

Takuo Ito

Hideki Arakawa

Junji Tomita

Kazuhide Kurosaki

There is provided a method of fabricating a semiconductor device including forming a first film on a base layer, forming a first mask pattern on the first film, the first mask pattern having mask portions arranged at a given pitch, forming first sidewall films on sidewalls of the first mask pattern by etchback of a deposited second film, removing the first mask pattern, and forming a second mask pattern composed of the first sidewall films and second sidewall films defined by etchback of a deposited third film. It is possible to form a stripe pattern with the line width and the line space thereof having the same sizes and at a pitch the same as the minimum process size determined by the photolithographic performance, thereby enabling fabrication of a semiconductor device with a high degree of integration.

Transistor formation method using sidewall masks

A flash memory having a nonvolatile memory cell, includes a plurality of banks each having a plurality of sectors, an erasing voltage generator circuit and a writing voltage generator circuit, wherein while an applying an erase pulse to a sector to be erased in a first bank, an erasing control is performed by, a pre-writing control is concurrently performed by applying a writing pulse to a sector to be erased in a second bank. At the time when erasing control of the sector to be erased in a first bank is finished, pre-writing control of the sector to be erased in a second bank is finished or partially finished, and thus the time required for erasing operations of the first and the second bank can be reduced.

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Kawasaki, Japan

Takuo Ito