Nitto-Denko Corporation

Takumi Yutou

Takamasa Hirayama

Shusaku Ueno

Masahiko Ando

Kazuhito Okumura

Toshitaka Suzuki

Ryoko Asai

Yuka Sekiguchi

Masato Shirai

Mitsushi Yamamoto

Shinichi Takada

Rie Hayashiuchi

Asuka Endo

Minoru Hanaoka

Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of grinding accuracy, low contamination property, productivity, and fixing property. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains: a pressure-sensitive adhesive containing a base polymer; and a foaming agent having a foaming temperature of 90° C. or more, and wherein the pressure-sensitive adhesive sheet has, when a pressure-sensitive adhesive surface thereof is bonded to a silicon chip, a shear adhesive strength of 1.0 MPa or more under an ambient temperature of 25° C., and a shear adhesive strength of 0.2 MPa or more under an ambient temperature of 80° C.

Adhesive sheet

Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of low contamination property, productivity, grinding accuracy, and peelability. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a thickness of from 1 μm to 300 μm, and wherein a microhardness H (Pa) of the pressure-sensitive adhesive layer at 25° C. and the thickness, which is represented by h(μm), of the pressure-sensitive adhesive layer satisfy a relationship represented by the following expression (1). log≥1.9385×log+4.2611 . . . (1).

A pressure-sensitive adhesive tape that uses, as a plasticizer, an alternative compound to bis(2-ethylhexyl) phthalate (DOP) and dibutyl phthalate (DBP), having excellent tackiness, and can be unwound satisfactorily, where DOP and DBP are to be restricted under the REACH regulation. The pressure-sensitive adhesive tape includes a poly(vinyl chloride) substrate and a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer is disposed on or over one side of the substrate. The poly(vinyl chloride) substrate contains 10 to 40 percent by weight of bis(2-ethylhexyl) terephthalate. The pressure-sensitive adhesive tape preferably has an unwinding force of 0.4 N/20 mm or less at a tensile speed of 0.3 m/min and an unwinding force of 1.2 N/20 mm or less at a tensile speed of 30 m/min.

Pressure-sensitive adhesive tape

A film for a pressure-sensitive adhesive tape is a film for a pressure-sensitive adhesive tape, including a non-pressure-sensitive adhesive layer on one surface of a plastic film, where the non-pressure-sensitive adhesive layer includes a mixed layer of a silicone and a (meth)acrylic polymer; and the (meth)acrylic polymer has a calculated Tg of 10&#xb0; C. or more.

Film for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape

There are provided an optical surface protection film capable of permitting even a visual inspection of a coated body having a fine roughness, such as a prism sheet, to be performed under the condition that the protection film is attached to the coated body and excelling in adhesion reliability without an optical adverse effect on the coated body, and an optical film with the surface protection film. The optical surface protection film () has a base material layer () and an adhesive layer () stacked on one surface of the base material layer. The surface of the base material layer () on the side of the adhesive layer () has an arithmetic surface average roughness (Ra) of 0.65 &#x3bc;m or less. The other surface of the base material layer () has an arithmetic surface average roughness (Ra) of 0.6 &#x3bc;m or more.

Growing community of inventors

Ibaraki, Japan

Takumi Yutou