Rohm Co., Ltd.

Takumi Yamade

Hiroaki Hayashi

Eiji Yokoyama

Tadatoshi Miwa

Yasuyuki Aritaki

Kuniaki Nakamura

Naofumi Kanei

Naoki Sekiguchi

Tomoharu Horio

Yuki Tanuma

Teruhisa Sako

Masatoshi Nakanishi

Hiroyuki Tajiri

Tadayoshi Sato

An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Image sensor module

An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

LED light source unit for backlight of liquid crystal display, and liquid crystal display

A thermal printhead (A) includes an insulating substrate (), a heating resistor () provided on the substrate () and a protective film () covering the heating resistor (). The protective film () is made up of a first layer (), a second layer () and a third layer (). The first layer () is held in contact with the heating resistor (). The second layer () covers the first layer (). The second layer () is harder than the first layer () and has a higher thermal conductivity than that of the first layer (). The third layer () is the outermost layer and covers the second layer (). The third layer () is harder than the second layer () and thinner than the second layer ().

Thermal print head

A thermal printhead (A) includes a substrate () and a heating resistor () supported by the substrate (). An electrode pattern () is formed in contact with the heating resistor () for applying driving voltage. The heating resistor () is covered with a protective film (). The protective film () includes a high thermal conductivity layer () and a low thermal conductivity layer () laminated on the high thermal conductivity layer. The low thermal conductivity layer () is positioned farther from the heating resistor () than the high thermal conductivity layer () is.

Thermal printhead

A thermal print head A includes a substrate, a heat generating resistorsupported by the substrate, and a protective layerwhich covers the heat generating resistor. The protective layerincludes a first inner layerwhich is in contact with the heat generating resistor, a second inner layerformed on the first inner layer, and an outer layer. Part of the second inner layeris formed as a rough surfacewhich has a surface roughness of Ra 0.1 through 0.3. The rough surfaceis disposed at a position corresponding to the heat generating resistor. The outer layeris made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 &#x3bc;m.

A thermal printhead A includes a glaze layerformed on an insulating substrate, a resistor layerformed on the glaze layer, a conductor layerformed so that part of the resistor layer is exposed to serve as a heating portionand a protective filmformed to cover the conductor layerand the heating portion. The protective filmincludes a lower first protective layer, and an upper second protective layeroverlapping the first protective layerand serving as the outermost layer. The first protective layerhas a hardness of 500 to 800 Hk and a thickness of 1 to 2 &#x3bc;m. The second protective layerhas a hardness of 1000 to 2000 Hk and a thickness of 5 to 8 &#x3bc;m.

Thermal print head and method for manufacturing same

A thermal printhead (A) includes an insulating substrate (), a glaze (), a plurality of pairs of first and second electrodes (A,B) and heating resistors (). Each of the heating resistors () includes a heating portion () spaced apart from the first electrode (A) and the second electrode (B). The respective ends (A,B) of the electrodes (A,B) are embedded in the glaze (). An insulating film () is provided between the heating portion () of each heating resistor () and the glaze (). The hardness of the insulating film () is higher than that of the glaze () and lower than that of the heating resistor (). The thermal conductivity of the insulating film () is higher than that of the glaze () and lower than that of the heating resistor ().

Thermal print head and method for manufacturing the same

A thermal printhead (A) includes a substrate (), a glaze layer (), a heating resistor (), an electrode () for energizing the heating resistor (), the electrode being mainly composed of Au, and a protective film () covering the heating resistor () and the electrode (). The electrode () has a surface formed with a plurality of recesses.

A thermal printhead (A) includes an insulating substrate (), a glaze layer (), a resistor layer (), an electrode layer () and a protective layer (). The electrode layer () has a two-layer structure made up of a lower first electrode layer () and an upper second electrode layer (). The resistor layer () includes a heating portion (). The heating portion () is exposed from both the first electrode layer () and the second electrode layer () and is positioned on a bulging portion () of the glaze layer ().

Thermal Print Head

A thermal printhead ( ) comprises a substrate ( ), an electrode pattern ( ) formed on the substrate, including a common electrode and a plurality of individual electrodes, a heating resister ( )connected to the electrode pattern ( ), and a protective coating ( ) including a plurality of layers ( ) covering the electrode pattern ( ) and the heating resister ( ). The protective coating includes an outermost layer ( ) composed mainly of SiC and an admixture of carbon.

Thermal print head and method of manufacturing thereof

The thermal printhead ( ) includes an insulating substrate ( ), a heating resister ( ) formed on the substrate ( ), a first glass coat layer ( ) formed on the substrate ( ) for covering the heating resister ( ), and a second glass coat layer ( ) formed on the first glass coat layer ( ). The heating resister ( ) has a centerline average roughness not greater than 0.3 &mgr;m. The first glass coat layer ( ) has a centerline average roughness not greater than 0.1 &mgr;m.

Thick-film thermal print head and its manufacturing method

A thermal printhead includes a head substrate ( ), a heating resistor ( ) provided on the head substrate, a plurality of individual electrodes ( ) connected to the heating resistor, and a common electrode ( ) connected to the heating resistor. The thermal printhead is further provided with a first coating layer ( ) covering the heating resistor, the individual electrodes and the common electrode, and a second coating layer ( ) which is formed on the first coating layer and made of sialon containing a conductive material as an additive. The first coating layer is formed with at least one through-hole ( ) or notch ( &prime;), so that the second coating layer is electrically connected to the common electrode via the through-hole or the notch.

Construction of thermal print head and method of forming protective coating

A thick-film thermal printhead includes an insulating substrate, an electrode pattern formed on the substrate and a linear heating resistor electrically connected to electrode pattern. The electrode pattern includes a common electrode and a plurality of individual electrodes. The common electrode includes a plurality of comb-teeth and a main conductor connected to the comb-teeth. The distance between the main conductor and the heating resistor is 0.25-0.75 times the width of the heating resistor.

Thick-film thermal printhead with improved paper transfer properties

A thermal printhead (A) includes an insulating substrate (,) having an upper surface (,) and a side surface (,), and a heat retaining glaze layer (,) formed on the substrate (,). A heating resistor (,) is formed on the glaze layer (,). The thermal printhead (A) further includes a common electrode (,) and a plurality of individual electrodes. The common electrode (,) has a plurality of teeth (,) connected to the heating resistor (,), and a connecting portion (,) which connects the teeth (,) with each other. An electrode auxiliary layer (,) is formed on the connecting portion (,). The heating resistor (,) and the electrode auxiliary layer (,) are covered with an overcoat layer (,) which is, in turn, covered with a protective layer (,). The connecting portion (,) of the common electrode (,) directly contacts both the glaze layer (,) and the upper surface (,) of the substrate.

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Kyoto, Japan

Takumi Yamade