Hitachi Metals, Ltd.

Hitachi Cable, Inc.

Takumi Sato

Kotaro Tanaka

Kenichi Murakami

Toshiyuki Horikoshi

Masahiko Saito

Hiromitsu Kuroda

Hideyuki Sagawa

Yasuhiro Funayama

Norio Okabe

Keisuke Fujito

Yasuharu Kameyama

Mamoru Ohashi

Yosuke Watanabe

Aki Suzuki

Asuka Okamoto

Yukio Kikuchi

A processing method includes processing a metal wire rod using an emulsion lubricant that includes an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio). The method may include purifying the emulsion lubricant after being used for processing the metal wire rod while maintaining the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio) and then reusing the purified emulsion lubricant to process the metal wire rod.

Processing method and purification system

A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.

Copper foil and method of manufacturing the same

A flat wiring member includes a plurality of rectangular enamel coated wires arranged in the form of a flat plate, a wiring stem portion that the rectangular enamel coated wires are arranged in parallel to each other and adjacent ones of the rectangular enamel coated wires are bonded to each other at a surface of an enamel coat layer thereof, and a wiring branch portion with the rectangular enamel coated wires bent so as to branch off from the wiring stem portion.

Flat wiring member and method of manufacturing the same

A wiring material includes conductors, each of which has a cross section having a thickness and a width not less than the thickness, a trunk portion in which the conductors are spaced parallel in a direction of the width thereof, a branch portion in which each conductor is bent and branched from the trunk portion in the direction of the width or in a direction that intersects the direction of the width, and a covering member for covering the trunk portion and the branch portion to expose both ends of the conductors.

Wiring material, method for fabricating the same, and secondary battery device and electronic equipment using the same

A method is for producing an electrode terminal connector for electrically connecting together a positive terminal and a negative terminal of mutually dissimilar metals. The method includes pressing a first plate of a similar metal to the positive terminal to form a mounting hole in the first plate, pressing a second plate of a similar metal to the negative terminal to form a metallic member which is larger in diameter than the mounting hole, and inserting the metallic member into the mounting hole by press fitting to join the first plate and the metallic member together. The method further includes providing the metallic member with an intervening layer of metal having an ionization tendency between an ionization tendency of metal constituting the first plate and an ionization tendency of metal constituting the second plate, and the first plate and the metallic member are joined together via the intervening layer.

Electrode terminal connector producing method

A singulation metal mold for singulating a plurality of semiconductor devices arrayed on a TAB tape has a punch as an upper metal mold of the singulation metal mold, a die block as a lower metal mold of the singulation metal mold, a knockout disposed to be slidable vertically inside a vertical hole formed in the die block, the knockout being operable to press up above the die block each of the singulated semiconductor devices left on the die block after the singulating, a press-up plate positioned under the knockout to support the knockout and linked mechanically to the knockout, and being operable to forcibly move the knockout vertically when the press-up plate moves vertically; and a press-up plate descent forcing mechanism that is operable to forcibly pull down the press-up plate.

Singulation metal mold and method for producing semiconductor device

&ldquo;&rdquo;-shaped slits and linking portions are previously provided so as to surround a semiconductor chip-mounting region in a TAB tape. A semiconductor chip is applied onto the semiconductor chip-mounting region. The semiconductor chip in its electrode pad is connected by bonding to the TAB tape in its inner lead. The bonded connection is subjected to plastic molding. Solder balls are provided on the backside of the TAB tape in its portion corresponding to the semiconductor chip-mounting portion. Thereafter, the package portion is cut off at the cutting position in the linking portion of the slits. By virtue of the above constitution, highly reliable BGA type semiconductor devices can be produced while reducing the thickness and reducing the size.

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Hitachi, Japan

Takumi Sato