Fujitsu Media Devices Limited

Taiyo Yuden Co., Ltd.

Taiyo Yudenco., Ltd.

Takumi Kooriike

Shunichi Aikawa

Osamu Kawachi

Yasufumi Kaneda

Kaoru Sakinada

Jyouji Kimura

Takashi Matsuda

Kazunori Inoue

Masayuki Kitajima

Naoyuki Mishima

Keiji Tsuda

Shingo Masuko

There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90&#xb0; with the solder melted.

Electronic device and method of fabricating the same

A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.

Method of manufacturing a surface acoustic wave device

A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.

Method of manufacturing an acoustic wave device

An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.

A package for an electronic device includes a cavity that houses an electronic element, and grooves or holes formed on or in sidewalls that define the cavity. The grooves or holes extend from an open side of the cavity so as not to reach a bottom side of the package.

Package for electronic device, base substrate, electronic device and fabrication method thereof

A surface acoustic wave device has a SAW device elementand a packagehousing the SAW device element. The package includes a resin substratehaving metal patternsandformed on both surfaces thereof, and a resin cap. The SAW device element is mounted on one of the metal patterns of the resin substrate. The resin cap is adhered to the resin substrate to cover the SAW device element. The surfaces of the resin substrate are flush with corresponding end surfaces of the resin cap.

Growing community of inventors

Suzaka, Japan

Takumi Kooriike