Shinko Electric Industries Co., Ltd.

Yokohama National University

Korea Shinko Microelectronics Co., Ltd.

National University Corporation Yokohama National University

Takumi Ikeda

Yasuyuki Kimura

Hiroyuki Arai

Tomoharu Fujii

Atsuto Yoda

Masao Kainuma

Chang Hun Gang

Tae Uk Gang

Hyung Gon Kim

HanSu Kim

HaeRyong Ahn

A sensor module includes a metal member having a side surface extending in a ring shape, and a recess recessed from the side surface and extending in a ring shape along the side surface, a resin part filling an inside of the recess, a radiating part provided in the resin part and configured to emit radio waves, a radio communication device provided in the resin part and electrically connected to the radiating part, and a sensor electrically connected to the radio communication device. The metal member is insulated from the radiating part by the resin part, and functions as a passive element.

Sensor module

A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

Header for semiconductor package and semiconductor package

A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.

Header for semiconductor package, and semiconductor package

A sensor module includes: a metal member having a recessed portion; a resin portion embedded within the recessed portion; a radiator provided within the resin portion and configured to emit radio waves; a wireless communication portion provided within the resin portion and connected to the radiator; and a sensor connected to the wireless communication portion, wherein the metal member is insulated from the radiator by the resin portion and functions as a parasitic element.

A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.

Header for semiconductor device, and semiconductor device

A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

Stem

A package for an optical semiconductor device includes an eyelet, a signal lead inserted in a through hole formed in the eyelet, and sealing glass sealing the signal lead in the through hole. The signal lead includes a first portion, a second portion and a third portion that are greater in diameter than the first portion and on opposite sides of the first portion, a first tapered portion extending from the second portion to the first portion, and a second tapered portion extending from the third portion to the first portion. The first portion and the first and second tapered portions are buried in the sealing glass. The total length of a part of the second portion in the sealing glass and a part of the third portion in the sealing glass is 0.2 mm or less.

Growing community of inventors

Nagano, Japan

Takumi Ikeda