Fujitsu Corporation

Takumi Ihara

Atsushi Kikuchi

Nobutaka Shimizu

Yasunori Fujimoto

Yoshiyuki Yoneda

Takao Nishimura

Masaharu Minamizawa

Muneharu Morioka

Kazuyuki Imamura

Masaru Nukiwa

Takao Akai

Osamu Yamaguchi

Yukihiro Kuriki

Masaki Uchida

A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board

The semiconductor device includes a substrate, a semiconductor component, and a cap covering the semiconductor component and attached to the substrate. The cap has a top wall, a plurality of side walls,extending downward from the top wall and a bottom wall. Opening are provided in the side walls of the cap at corners thereof. Due to the provision of openings, the cap can be manufactured without deformation thereof. Air or liquid can flow into, or out of, the interior of the cap, after the semiconductor deviced is completed.

Semiconductor device having cap

Growing community of inventors

Kawasaki, Japan

Takumi Ihara