Sony Corporation

Takuji Matsuo

Makoto Noda

Eiji Nakashio

Shota Nishi

Masato Suzuki

Junichi Sugawara

Seiji Onoe

Kenichi Izumi

Toru Katakura

An electronic device assemblyincludes: an electronic devicehaving flexibility; and a protection memberbonded to the electronic device. The protection memberincludes a metal foilthat is supported by a support memberhaving flexibility and an adhesive layerformed on the metal foil. The metal foilincluded in the protection memberis bonded to the electronic devicevia the adhesive layer

Electronic device assembly and protection member

The part of an MR element which lies close to a medium-facing surface overlaps that part of a flux-guiding element which lies remote from the medium-facing surface , with a second gap film interposed between the elements and Further, the MR element overlaps the flux-guiding element for a distance that falls within a range of 15 to 25% of the length of the MR height of the element as measured in a direction perpendicular to the medium-facing surface

Magnetoresistance-effect magnetic head

Growing community of inventors

Kanagawa, Japan

Takuji Matsuo