Ebara Corporation

Kose Corporation

Takuji Kobayashi

Nobuyuki Takahashi

Tadakazu Sone

Hiroomi Torii

Shuichi Ogawa

Akira Takase

Fumiko Noda

Megumi Imai

Yumiko Yakuden

Problem to be Solved Provided is a packing box that enables to easily release a slit lock in which slits of an insertion piece of an openable lid engage with side flaps connected to openable lid side edge portions of lid side members, even if the interior of a box body of the packing box is tightly filled with a product. Solution The top face lid () of the packing box () includes a part that can be torn along the tear inducing line () extending from the flap opposing edge () of the top face lid to the front end edge () of the top face lid (), and the part is held and torn along the tear inducing line () by a human hand and is raised up with respect to the top face lid () to form the slit lock release gripping piece () that can be used for releasing engagement created by the slit lock engaging structure (LK), so that the engagement by the slit lock engaging structure (LK), which is the engagement between the insertion piece () and the side flap () in the slit (SL) on the side in the lateral direction of the insertion piece () where the slit lock release gripping piece () is formed, can be easily released even if the interior of the box body of the packing box is tightly filled.

Packing box

A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher mechanism has a wafer rest for placing the wafer thereon and is arranged to allow the wafer released from the lower end surface of the top ring to be seated on the wafer rest. The pusher mechanism also has a sensor mechanism for detecting when the wafer is properly seated on the wafer rest. The sensor mechanism is adapted to block sensor light emitted from a light-emitting device by the wafer seated on the wafer rest.

Wafer transferring apparatus, polishing apparatus, and wafer receiving method

Growing community of inventors

Tokyo, Japan

Takuji Kobayashi