Hitachi, Ltd.

Renesas Technology Corp.

Hitachi Ulsi Systems Co., Ltd.

Hitachi Hokkai Semiconductor Ltd.

Takuji Ide

Takashi Wada

Eiji Niihara

Shunichiro Fujioka

Mitsue Ueno

Hiromichi Suzuki

Kazunari Suzuki

Fujio Ito

Akihiko Kameoka

Tomoo Matsuzawa

Toru Ishida

Tetsuharu Urawa

The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.

Semiconductor device having stacked semiconductor chips sealed with a resin seal member

A semiconductor device according to the invention is provided with square first semiconductor chip and second semiconductor chip laminated with each one main surface opposite, a supporting lead a part of which is arranged between one main surface of the first semiconductor chip and one main surface of the second semiconductor chip and a resin sealing body that seals the first semiconductor chip, the second semiconductor chip and the supporting lead and is characterized in that the respective one main surfaces of the first semiconductor chip and the second semiconductor chip are bonded to a part of the supporting lead via an adhesive layer and a part of the supporting lead is formed so that it has smaller width than the respective sides of the first semiconductor chip and the second semiconductor chip.

Semiconductor device and a method of manufacturing the same

Growing community of inventors

Higashimurayama, Japan

Takuji Ide