Hitachi Chemical Company, Ltd.

Takuji Abe

Katsutoshi Itagaki

Naoki Sasahara

Yoshiki Ajioka

Masaki Endou

Takahiro Fukaya

The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film () according to the invention comprises a support (), resin layer () and protective film (), where the resin layer () is composed of a photosensitive resin composition comprising a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a benzotriazole derivative represented by the following general formula (1). [wherein Rand Reach independently represent hydrogen or a monovalent organic group, and Rrepresents a halogen atom, an alkyl, cycloalkyl, allyl, aryl, amino, alkylamino, nitro, cyano, mercapto, alkylmercapto, hydroxyl, hydroxyalkyl, carboxyl, carboxyalkyl, acyl or alkoxy group or a monovalent group with a heterocyclic ring, with the proviso that at least one of Rand Ris an optionally substituted aryl group or an organic group containing a C10 or greater hydrocarbon group.]

Photosensitive resin composition and photosensitive film made with the same

A photosensitive resin composition is here disclosed which satisfies the following (1) and (2):

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Hitachi, Japan

Takuji Abe