Tdk Corporation

Taku Someya

Hideki Kuwajima

Hiroyuki Endo

Osamu Onitsuka

Akira Ebisawa

Kouji Yasukawa

A dynamic vibration absorber includes an arm section that includes an elastic unit; and a weight section that is connected to the arm section and includes a mass unit. The arm section and the weight section each include a plurality of stacked single-layer materials having different degrees of elasticity and specific gravities, and at least one of the single-layer materials of the arm section and at least one of the single-layer materials of the weight section are shared in common.

Dynamic vibration absorber, flexure, and head support mechanism

To control the resonance generated in the head assembly and improve property on the head location controlling. A head assembly includes: a slider having a head element; a slider supporting plate for holding the slider; a load beam for holding the slider supporting plate; a support projection which is arranged on the front end part of the load beam and on which the slider supporting plate is supported rotatably; a drive unit that rotates the slider supporting plate around the support projection; a dynamic vibration absorber arranged on the slider supporting plate, wherein the dynamic vibration absorber is disposed closer to the rear end side of the load beam than the support projection and has vibration freedom in the rotating direction of the slide supporting plate.

Head assembly and magnetic disk device

Head assembly and magnetic disk device, wherein reaction force induced by warpage of driving element during operation can be decreased and unnecessary resonance can be suppressed, in addition, displacement amount of head element can be efficiently obtained. A head assembly includes first buffering part connecting first reinforcing part and first displacement transferring part with flexural rigidity lower than those of first reinforcing part and first displacement transferring part; second buffering part connecting second reinforcing part and main part of flexure with flexural rigidity lower than those of second reinforcing part and main part of flexure; third buffering part connecting third reinforcing part and second displacement transferring part with flexural rigidity lower than those of third reinforcing part and second displacement transferring part; and fourth buffering part connecting fourth reinforcing part and main part of flexure with flexural rigidity lower than those of fourth reinforcing part and main part of flexure.

A head assembly includes: a first link that is disposed to interconnect between a first joint connected to a slider support plate and a second joint connected to a first fixing unit; a second link that is disposed to interconnect between a third joint connected to the slider support plate and a fourth joint connected to a second fixing unit; a first drive unit that drives the first link; and a second drive unit that drives the second link.

Head assembly

An organic EL structure is formed on a substrate,and a sealing sheet is located at a position above the substrate, where the sealing sheet comes in no contact with the organic EL structure. A height from the surface of the substrate, on which an organic EL device structure in a film form is provided, to a junction of the sealing sheet with the substrate has a value larger than the value obtained by adding the size of an irregularity or undulation of the sealing sheet to the height of the organic EL structure.

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Tokyo, Japan

Taku Someya