Kabushiki Kaisha Shinkawa

Shinkawa U.s.a., Inc.

Takeyuki Nakagawa

Hiromi Tomiyama

Takashi Takeuchi

Satoshi Enokido

Yoshiyuki Ogata

Satoru Nagai

Naoki Kanayama

Yasuo Chiyo

In a tray conveying apparatus and method for, for instance, semiconductor parts, a main station and substation which have a tray conveying function are driven slidably in a direction perpendicular to a tray conveying line by a station sliding mechanism. When the preparation of a satisfactory-parts tray is required, the sub-station is positioned on the conveying line, and a satisfactory-parts tray is prepared on this sub-station by means of the exchange of parts, etc. Afterward, both main station and sub-station are caused to slide so that the main station is positioned on the conveying line. In this state, the satisfactory-parts tray is positioned in the vicinity of the conveying line, and a tray on the main station is replenished with satisfactory parts from the satisfactory-parts tray. A table sliding mechanism is further provided that has an upper-stage table, which carries a defective-parts tray, and a lower table, which caries a reclaimable-parts tray.

Tray conveying apparatus and method

A method and apparatus for inspecting bends in wires bonded between, for instance, pads of semiconductor chips and leads of lead frames using detection ranges established within imaging ranges in which images of bends are taken. Imaging range areas are established by dividing the distance between a first bonding point and a second bonding point of a target wire by the width of the detection range, and the wire bend is then detected in the respective imaging range areas.

Wire bend inspection method and apparatus

Workpieces in which, for example, wire bonding has been performed are inspected to determine if they are defective or not by an inspection device. Workpieces which have been found to be defective are conveyed to one workpiece magazine and workpieces which have been found to be defect-free are conveyed to another workpiece magazine, thus defective and non-defective workpieces are separated immediately after inspection.

Workpiece conveying apparatus used with workpiece inspection device

A method for evaluating the height of a wire bonded between a semiconductor chip and a lead frame including the steps of: investigating the correlation between wire height and wire width beforehand by shifting the focusing level of an optical system, setting a detection level which is the focusing level of the optical system based upon an upper limit level and a lower limit level which are to be the standard levels for the height of the wire to be detected. The acceptability of the height of the wire is judged by ascertaining whether or not the imaged width of the wire is within the wire width range which is between the upper and lower limit levels of the correlation between the wire height and the wire width.

Bonding wire height detection method

In a lead frame retainer mount used in, for example, wire bonding machines, tapered edges are formed on opposite ends of a frame retainer, and a frame retainer carrier which carries the frame retainer and tapered sections which engage with one of the tapered edges of the frame retainer are formed in the frame retainer holder. In addition, a fastening assembly which fastens the frame retainer to the frame retainer holder includes a handle mounted on the frame retainer holder and a clamp which is raised and lowered by a spring when the handle is turned so as to press against the other tapered edge of the frame retainer. Thus, replacement of the frame retainer can be accomplished very easily and in a short amount of time.

Frame retainer mount used in bonding machines

A clamping device for bonding machines used in manufacturing semiconductors including a clamp receiver, a rotatable lock key movable in a vertical direction on the clamp receiver, an air cylinder which pulls up and down the lock key, and a clamp which has a bonding window for bonding tool and an opening for the lock key passing through it. The clamp is mounted on the clamp receiver by letting the lock key pass through the opening, and then the lock key is turned so as not to accord with the opening. When the air cylinder is actuated, the lock key is pulled down and presses the clamp against the clamp receiver, securely positioning the clamp on the clamp receiver. Thus, the changing operation of the clamp is easily and quickly performed because the clamp can be removed by merely rotating the lock key and turning on and off the air cylinder.

Growing community of inventors

Tokyo, Japan

Takeyuki Nakagawa