Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Takeyuki Kawase

Osamu Okuda

Shuzo Yagi

Yoshiyuki Kitagawa

Noriaki Yoshida

Akira Kabeshita

Toshiyuki Kino

Shigeki Imafuku

Takanori Yoshitake

Yoshihiko Misawa

Hideaki Watanabe

Hiroshi Uchiyama

Naoto Mimura

Junkei Shimizu

Yoichi Tanaka

Taira Ishii

Kazuhiko Itose

Satoshi Yamauchi

Tetsutarou Hachimura

Toshiro Nishiwaki

Mitsuo Kawate

Yuji Tanaka

Tadashi Endo

Nobuhiro Nakai

Takashi Yazawa

Kimiaki Sano

Yoshiyuki Hattori

Youichi Tanaka

Akira Noudo

Tomio Tanaka

Tamaki Ogura

Hiroshi Ogata

Naoto Kohketsu

Iwao Kanetaka

Hiroshi Uchixama

Noriaka Yoshida

There is provided a component mounter including: a plurality of transport lanes for transporting a board sorted by a board sorting device; a congestion index calculator for calculating a congestion index indicating a congestion degree of each of the plurality of transport lanes; a transport lane determiner for determining a transport lane for carrying in the board among the plurality of transport lanes based on the calculated congestion index; and an outputter for outputting a board request signal for requesting to carry the board into the transport lane determined by the transport lane determiner, to the board sorting device.

Component mounter, component mounting line, and manufacturing method of mounting board

A component mounting method used in a system with a plurality of component mounting apparatuses includes reading out a substrate ID of a substrate and detecting whether the substrate is in a state of being able to be inserted or removed from one of the component mounting apparatuses. If the substrate is not in a state of being able to be inserted or removed, the substrate ID of the substrate is delivered by an upstream component mounting apparatus. If the substrate is in a state of being able to be inserted or removed the substrate ID is read in a downstream component mounting apparatus.

Method of mounting a component on a circuit substrate

An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M) to (M*), each of which has a first mounting lane (L) and a second mounting lane (L), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M*) each of which is equipped with a tray feeder () is brought into the second operation mode.

Electronic component mounting method

In the operation execution step wherein the operation switches are clicked to execute the operation related to product-type switching, if the substrate presence/absence detecting sensors S, Sthat detect the presence/absence of substrates in the front-side substrate transporting mechanismA and rear-side substrate transporting mechanismB detect the presence of substrates, it is judged that the manufacturing operation of the corresponding substrate type has not ended, and the input control processing is executed so that the input operation by the operation switch for executing the operation related to product-type switching is prohibited. As a result, it is possible to prevent the problems related to reloading of the mounting program before the manufacturing has ended.

Component mounting device and product-type switching method

Electronic component mounting system

In a component mounting device () which has a first mounting lane (L) and a second mounting lane (L) and which is structured so as to be able to select either an independence mounting mode or an alternation mounting mode, when device type changing operation is performed with change of the type of boards which are the mounted objects, if a tape feeder float detecting sensor () that is provided in proximity of an opening () through which a part of the body or the foreign object enters in the component supplying part is, detects a part of the body such as a finger () of the operator or the foreign object, operation of the component mounting mechanism which belong to the mounting lane opposite to the mounting lane to which the component supplying part, in which the optical sensor is provided, belongs is stopped.

Component mounting device and component mounting method

When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening () formed in a protective cover () can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.

In a component mounting device () which includes a first mounting lane (L) and a second mounting lane (L) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (RA) and a first limited movable area (RB) in which the movements in the horizontal direction of a first mounting head (A) and a second mounting head (B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.

An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (A,B) positioned lateral to conveyor lines including conveyors (A,B,C,D) arranged in parallel; and a substrate distributing unit (MB) configured to distribute substrates () delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate () is carried in from the substrate distributing unit (MB) into conveyors (A,D) which are closest to the component supplying units (A,B) among the conveyors (A,B,C,D). Therefore, substrates can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.

Component mounting apparatus and substrate conveyance method in component mounting apparatus

In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a 'file operation' () which are displayed by selecting a 'device type changing' () which is displayed in an operation screen () on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch () is prohibited so that a second mounting lane (L) which is producing will not become an object of the inputting of operations.

Component mounting device in which a device type changing operation is performed in one mounting lane without stopping another mounting lane

An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (A,B) positioned lateral to conveyor lines including conveyors (A,B,C,D) arranged in parallel; and a substrate distributing unit (MB) configured to distribute substrates () delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (B,C) which are farther from the component supplying units (A,B), when the substrate request signal R is output for a conveyor (D) which is closer to the component supplying unit () prior to start of a transferring work of the new substrate (), the new substrate () is carried into the conveyor (D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.

A substrate conveyor track is provided with first to fourth conveyors. Two conveyors situated on both sides of the substrate conveyor track, and the other two conveyors situated at the center of the same. There is enabled selection of any one from a small substrate mounting mode for giving a single substrate conveyance width to the four conveyors and mounting electronic components on four small substrates having the single width; a large substrate mounting mode for actuating all movable conveyors to the center of the substrate conveyor track and mounting electronic components on two large substrates by the two conveyors; and a large-small-substrates mounting mode for bringing the two conveyors on one side of the substrate conveyor track, among the four conveyors, into the small substrate mounting mode and bringing one of the conveyors on the other side of the track into the large substrate mounting mode.

Electronic component mounting device

There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (). In addition, the nozzle can be elevated in an arc trajectory.

Component mounting method

A method of mounting supply components includes the step of inserting dish-like members into a base. Each dish-like member holds components. One dish-like member can stay inserted in the base while the other dish-like member is removed from the base and refilled with components.

Component supply method

A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter () equipped with a transfer head () having a component-sucking-and-holding nozzle (), for transferring a component P and mounting the component P onto a board (), and includes: lowering the component P to within the high-accuracy range of a first line sensor () for measuring the height of the component P; and measuring the height of the component P using the first line sensor ().

Growing community of inventors

Yamanashi, Japan

Takeyuki Kawase