Nec Corporation

Takeya Hashiguchi

Hitoshi Sakamoto

Minoru Yoshikawa

Kazuyuki Mikubo

Takeshi Inoue

Masaharu Ito

Kenichi Maruhashi

Keiichi Ohata

Kazuhiro Ikuina

Osamu Myohga

Kenichi Inaba

A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.

Phase change cooler and electronic equipment provided with same

A cooling structure is provided which includes: an evaporation chamber defined by a base plate having a boiling surface, a ceiling plate and a side wall; a plurality of plate-shaped fins arranged in parallel on the boiling surface, defining a plurality of coolant passages in the evaporation chamber, a liquid phase coolant flows through the coolant passages in one direction from one end portion thereof toward another end portion; a liquid return port formed in the side wall facing the one end portion of coolant passages; and a vapor port formed in the ceiling plate facing the other end portion of coolant passages, wherein space is formed between the ceiling plate and an upper end portion of the plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of the side wall toward the vapor port.

Cooling structure, electronic device using same, and cooling method

A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.

Boiling heat transfer device

Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus)includes: housingthat forms sealed inner space; circuit unitthat is provided in inner space; first partition platethat is provided in inner spaceand that has upper/lower partition portion, wherein upper/lower partition portionat least partially extends in a lateral direction extending above at least a part of circuit unitand that terminates in front of both lateral sides of housing; and first fanthat is provided through upper/lower partition portion

Electronic apparatus, image display apparatus and method of cooling electronic apparatus

A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component.

Cooling device

Provided is a highly reliable liquid crystal display device that prevents the penetration of a flying dust and dirt in the outside air. A liquid crystal display device () having a display unit housing case () configured to house a light source unit and a display unit, and an electronic component housing case () configured to house an electronic component. The liquid crystal display device () is tightly closed and externally disposed with heat radiation fins (and).

Dust and dirt resistant liquid crystal display device

A liquid crystal display device includes a sealed housing part, a liquid crystal display part disposed at the front face of the housing part, a light source part housed in the housing part to generate the light to be displayed on the liquid crystal display part, an electric power supply part housed in the housing part to perform electric power supply, a control part housed in the housing part to perform control, and a heat exchange part disposed at the rear face of the housing part to cool the heat generated in the housing part. The heat exchange part includes an air stirring part for stirring the air in the housing part, a forced air cooling part covered with a duct in which the air stirring part is installed and constructed from a plate extending into the housing part, and a natural air cooling part constructed from a plate extending to the outside of the housing part. The forced air cooling part and the natural air cooling part are integrated with a rear face plate of the housing part.

Liquid crystal display device

A high frequency circuit substrate comprises a first high frequency circuit substrate including at least a first dielectric material layer, a first conductor layer, a second dielectric material layer and a second conductor layer, which are laminated in the named order, the first conductor layer having a first slot formed therein, and the second conductor layer forming a transmission line, the first dielectric material layer having a first opening exposing the first slot at its bottom. The high frequency circuit substrate also comprises a second high frequency circuit substrate including at least a third dielectric material layer, a third conductor layer, a fourth dielectric material layer and a fourth conductor layer, which are laminated in the named order, the third conductor layer having a second slot formed therein, and the fourth conductor layer forming a transmission line, the third dielectric material layer having a second opening exposing the second slot at its bottom. The first high frequency circuit substrate and the first high frequency circuit substrate are bonded to each other in such a manner that the first dielectric material layer and the third dielectric material layer are faced to each other and the first slot and the second slot are electromagnetically coupled, by inserting one side and the other side of a conductor plate having a through hole into the first opening and the second opening, respectively.

High frequency circuit substrate and method for forming the same

An ultrasonic motor comprises a rotor and a stator between which a pressurized face-to-face contact is established. The stator includes a longitudinal vibrator for producing a longitudinal thrust in the axial direction thereof and a torsional vibrator for transmitting a torsional thrust to the rotor in response to a longitudinal thrust timely generated by the longitudinal vibrator. The stator is supported by a structure which comprises a ring portion secured to the stator and a plurality of limb portions radially extending from the ring portion. Each of the limb portions has such an effective length and a width that the oscillation frequency of the motor matches the primary resonant frequency of a vibration of the limb portion generated on a plane normal to the axial direction of the stator and has such a thickness that the oscillation frequency matches an intermediate point between adjacent antiresonant frequencies of a vibration of the limb portion generated in the axial direction of the stator.

Growing community of inventors

Tokyo, Japan

Takeya Hashiguchi