Nitto-denko Corporation

Taketo Ishikawa

Hironobu Machinaga

Naoki Nagaoka

Daisuke Nakamura

Manami Kurose

Takahiro Ikeda

Takahiro Shimizu

Kyotaro Yamada

Takahiko Yanagitani

Hironori Kuwayama

A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.

Wiring circuit board and method of producing the wiring circuit board

The occurrence of cracking in a functional layer is suppressed, while maintaining flexibility of a layered structure. The layered structure includes a polymer substrate, and a crystalline functional layer formed on the first surface of the substrate. The surface roughness of the first surface of the substrate is 3 nm or less in terms of arithmetic mean roughness (Ra).

Layered structure, piezoelectric device using the same, and method of manufacturing piezoelectric device

A piezoelectric device having a high conversion efficiency between electrical energy and mechanical energy is provided. The piezoelectric device has first electrode, a second electrode, and a piezoelectric layer provided between the first electrode and the second electrode, wherein the piezoelectric layer is formed of a ZnO-based material having a wurtzite crystal structure to which a metal that does not cause the piezoelectric layer to exhibit conductivity is added, and wherein a squared value of a electromechanical coupling coefficient in thickness vibration mode is 6.5% or more.

Piezoelectric device and method of manufacturing the same

A piezo electric device having a configuration that can suppress the formation of a leakage path between electrodes that sandwich a piezoelectric layer and also reduce deterioration in the piezoelectric characteristics, is provided. The piezoelectric device has a first electrode, a piezoelectric layer, and a second electrode stacked in this order on a substrate. The first electrode and the second electrode are arranged so as not to overlap each other in the stacking direction.

Growing community of inventors

Ibaraki, Japan

Taketo Ishikawa