Tokyo Electron Limited

Takeshi Yokouchi

Noriyuki Iwabuchi

Fumiko Yagi

Shinichiro Hayasaka

Ken Horiuchi

Hiroshi Nakamura

Seiichi Kaise

Eiji Hirose

Akira Obi

Shigeaki Kato

Mariko Shibata

Shingo Suzuki

Fumiko Yokouchi

A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second branch line; a branch flow control unit; an additional gas supply unit; an additional gas supply line; and a control unit. The control unit performs, before processing the substrate to be processed, a processing gas supply control and an additional gas supply control by using the processing gas supply unit and the additional gas supply unit, respectively, wherein the additional gas supply control includes a control that supplies the additional gas at an initial flow rate greater than a set flow rate and then at the set flow rate after a lapse of a period of time.

Gas supply method

Gas supply system, substrate processing apparatus and gas supply method

A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.

Substrate processing method, system and program

A substrate processing apparatus includes a substrate processing unit for performing a process on substrates; a recipe protection unit for prohibiting processing conditions for the process from being changed while the process is being performed on a specific number of substrates; a protection cancellation unit for canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying unit for modifying the processing conditions. Further, a method for examining substrate processing conditions includes a protection cancellation step of canceling a prohibition of a change in the process to allow the processing conditions to be changed while the process is being performed on the specific number of substrates; and a modifying step of modifying the processing conditions.

Substrate processing apparatus, method for examining substrate processing conditions, and storage medium

First and second pressure sensorsandthat perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamberof an etching device. A pressure controllerselects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensorsand. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamberand thus obtains pressure data achieving a predetermined data density. The pressure controllercontrols a pressure control valveso as to ensure that the pressure data match preset pressure data.

Pressure control method and processing device

The present invention provides a substrate processing apparatus that executes electrical discharge processing before detaching a substrate held onto an electrostatic chuck of a lower electrode constituting a stage and undergoing a specific type of processing from the electrostatic chuck. Before electrically discharging the substrate, a decision is made as to whether or not the specific type of processing on the substrate has ended normally, and electrical discharge conditions are set based upon regular electrical discharge condition information stored at a regular electrical discharge condition information storage means if the substrate processing is judged to have ended normally, whereas electrical discharge conditions are set based upon non-regular electrical discharge condition information stored at a non-regular electrical discharge condition information storage means if the substrate processing is judged not to have ended normally. Then, under the electrical discharge conditions having been set, electrical discharge processing is executed on the substrate.

Method for electrically discharging substrate, substrate processing apparatus and program

Growing community of inventors

Miyagi-gun, Japan

Takeshi Yokouchi