Dainippon Screen Mfg. Co., Ltd.

Takeshi Yane

Yasuhiro Mizohata

In the zinc oxide film forming apparatus (), the deposit containing zinc oxide is formed on the conductive layer of the resin substrate () by electrodeposition in the deposition part (), and the resin substrate () is carried to the applying part (). Subsequently, the film forming material which is in liquid or paste form and contains particles of zinc oxide and solvent is applied onto the conductive layer, and then the solvent is removed from the film forming material on the conductive layer by volatilization. It is therefore possible to easily and efficiently form the porous zinc oxide film which has superior adhesion to the conductive layer of the resin substrate ().

Zinc oxide film forming method and apparatus

A pressure sensor comprises a thin disk-shaped diaphragm, a laser displacement meter for detecting an amount of deformation of the diaphragm, and an operation part connected to the laser displacement meter. In the pressure sensor, an amount of deformation of the diaphragm due to pressure of fluid flowing into the pressure sensor is detected by the laser displacement meter, and pressure of the fluid is obtained on the basis of the amount of deformation and conversion information stored in the operation part in advance. The base part of the diaphragm of the pressure sensor is made of graphite (or silicon substrate), and a thin film of silicon carbide which is in contact with fluid is formed on a surface of the base part. This improves chemical resistance to the pressure sensor and extends the lifetime of the pressure sensor while preventing metal elution.

Pressure sensor and substrate processing apparatus

A plating apparatus for plating a substrate. The apparatus is provided with a plating unit, a substrate cleaning unit, a substrate transport mechanism, a post-treatment agent supplying section, a minor constituent managing section for managing minor constituents (an accelerator, a retarder and chlorine) of a plating liquid being used in the plating unit, an enclosure which houses therein a substrate treating section including the plating unit, the cleaning unit and the substrate transport mechanism, and a system controller for controlling the entire apparatus.

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Kyoto, Japan

Takeshi Yane