Tdk Corporation

Takeshi Yanata

Takeshi Oyanagi

Yusuke Imai

Naoyoshi Yoshida

Satoshi Goto

Yuji Terada

Koichi Ishii

Masayuki Uchida

Daiki Suzuki

Shin Kagaya

Yo Saito

Takashi Inagaki

Hitoshi Ishida

Katsunari Moriai

Takahiro Itami

Kazuto Takeya

Dai Matsuoka

Kaname Ueda

Naoki Chida

Masato Hayatsu

A transient voltage protection device includes: an element body; a cavity portion provided in the element body; a pair of internal electrodes disposed in the element body; and a pair of external electrodes connected to the pair of internal electrodes. The pair of internal electrodes extend along a first direction and face each other in a second direction intersecting the first direction. The cavity portion includes a gap region located between the pair of internal electrodes in the second direction. A tip portion of at least one of the pair of internal electrodes is in contact with only the element body.

Transient voltage protection device

A chip varistor includes an element body exhibiting varistor characteristics, internal electrodes containing a first electrically conductive material, and an intermediate conductor containing a second electrically conductive material. The intermediate conductor is separated from the internal electrodes in a direction in which the internal electrodes oppose each other, and is disposed between the internal electrodes. At least a part of the intermediate conductor overlaps the internal electrodes in the direction in which the internal electrodes oppose each other. The element body includes a low resistance region in which the second electrically conductive material is diffused. The low resistance region is located between the first and second internal electrodes in the direction in which the first and second internal electrodes oppose each other.

Method for producing chip varistor and chip varistor

A multilayer chip varistor includes an element body, first and second external electrodes, and first and second electrical conductor groups. The first electrical conductor group includes a first internal electrode connected to the first external electrode, and a first intermediate electrical conductor opposed to the first internal electrode. The second electrical conductor group includes a second internal electrode including a first electrically conductive material and connected to the second external electrode, and a second intermediate electrical conductor opposed to the second internal electrode. At least one of the first and second intermediate electrical conductors includes the second electrically conductive material. The element body includes a low electrical resistance region between the first and second internal electrodes. The second electrically conductive material is diffused in the low electrical resistance region.

Multilayer chip varistor

A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.

Piezoelectric device

Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device () includes a package () including a housing member () having a thermistor substrate () and a frame () provided to project from a first main surface () of the thermistor substrate () and in which a housing part () is formed by the first main surface () and the frame () and a lid () provided on the frame () to cover a space () of the housing part (), and a piezoelectric vibration element () provided on the first main surface () of the thermistor substrate () in the housing part (), wherein the thermistor substrate () is a multilayer negative temperature coefficient (NTC) thermistor.

Temperature compensated piezoelectric oscilator device package wherein the base of the package consists of a multilayer thermistor

A surge absorbing circuit has a substrate on which a first conductor, a second conductor, and a third conductor are placed, and a surge absorber having a first terminal and a second terminal. The first conductor and the second conductor are mutually coupled in a polarity-reversed relation. One end of the first conductor is connected to one end of the second conductor. The third conductor is electrically isolated from the first conductor and the second conductor on the substrate. The first terminal of the surge absorber is connected to a connection portion between the first conductor and the second conductor. The second terminal of the surge absorber is connected to the third conductor.

Surge absorbing circuit

A connector which can reduce electrostatic surges without deteriorating high-speed signals is provided. The connector in accordance with the first embodiment of the present invention comprises a first terminal, a second terminal connected to the first terminal, and a surge absorbing circuit provided between the first and second terminals. The surge absorbing circuit comprises (a) a first inductor having one end connected to the first terminal; (b) a second inductor, electromagnetically coupled to the first inductor, having one end connected to the other end of the first inductor and the other end connected to the second terminal; and (c) a surge absorbing element having one end connected to the other end of the first inductor and the one end of the second inductor and the other end connected to a ground terminal.

Connector

A surge absorber has a first terminal electrode, a second terminal electrode, a third terminal electrode, an inductor portion, a surge absorbing portion, and a resistor portion. The inductor portion has a first internal conductor and a second internal conductor mutually coupled in a polarity-reversed relation. One end of the first internal conductor is connected to the first terminal electrode. One end of the second internal conductor is connected to the second terminal electrode. The other end of the first internal conductor is connected to the other end of the second internal conductor. The surge absorbing portion has a first internal electrode and a second internal electrode. The first internal electrode is connected to the other end of the first internal conductor and to the other end of the second internal conductor. The second internal electrode is connected to the third terminal electrode. The resistor portion has a DC resistance component connected between the first terminal electrode and the second terminal electrode.

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Tokyo, Japan

Takeshi Yanata