Nitto-Denko Corporation

Tanabe Seiyaku Company, Limited

Mitsubishi Tanabe Pharma Corporation

Takeshi Yamanaka

Masahiko Ando

Yasuyuki Tokunaga

Waka Hikosaka

Hiroshi Yamamoto

Makoto Kojima

Hiroshi Wada

Katsuya Kume

Hiroaki Mashiko

Mitsuo Kuramoto

Yoshikazu Soeda

Naoki Matsuoka

Yoshinao Kitamura

Shin-ichi Kouno

Kenichi Shibata

Koichi Hashimoto

Toshitsugu Hosokawa

Yutaka Moroishi

Akihisa Murata

Hiroshi Ohmizu

Kooki Ooyama

Masami Takahashi

Rikako Kono

Masahiko Seki

Tsutomu Miyake

Hidetoshi Asai

Hiraku Yamamoto

Shinetsu Itou

Takeshi Suto

Isamu Miyoshi

Shinkiti Yamashita

Katsuhito Kamiya

Provided is a re-peeling pressure-sensitive adhesive composition for a surface protecting material for an adherend having a photocatalytic layer, comprising: a (meth)acryl-based polymer including, as monomer units, 50 to 99.9% by weight of (A) at least one acrylate-based monomer represented by the general formula (1): CH&#x2550;CRCOORwherein Rrepresents a hydrogen atom or a methyl group, and Rrepresents an alkyl group having 2 to 14 carbon atoms, 0.1 to 10% by weight of (B) a functional-group-containing vinyl-based monomer, and 0 to 49.9% by weight of (C) a vinyl-based monomer copolymerizable with the component (A) and/or the component (B); and (D) a surfactant having a molecular weight of 150 to 5000, the amount of the component (D) being from 0.01 to 30 parts by weight with respect to 100 parts by weight of the (meth)acryl-based polymer. The re-peeling pressure-sensitive adhesive composition is excellent in re-peeling property, contact-angle-recoverability, and weather resistance.

Removable adhesive composition, removable adhesive layer, adhesive sheet, and surface protective material

The present invention relates to a piperidine compound represented by the formula [I]:  

Piperidine compound and process for preparing the same

A removable pressure-sensitive adhesive which, even when applied to metal sheets or to metallic members which have undergone a coating treatment, is inhibited from increasing in adhesive force with the lapse of time and can be easily removed therefrom and which has satisfactory weatherability and satisfactory pot life contains 100 parts by weight on a solid basis of an aqueous dispersion type acrylic copolymer obtained by polymerizing a monomer mixture in an aqueous medium in the presence of a nonionic surfactant and/or an anionic surfactant each having an ethylenic double bond and 0.1 to 3 parts by weight of a hindered-amine light stabilizer having a piperidine ring in which the nitrogen atom has a tertiary amine structure; and an adhesive sheet is produced with the adhesive.

Removable pressure-sensitive adhesive and adhesive sheet of the same

Printable pressure-sensitive adhesive sheet and sealing material containing same

A pressure-sensitive adhesive composition, wherein the storage elastic modulus &lsqb;G&prime;&rsqb; at room temperature is at least 2&times;10,dyne/cm,and the adhesive strength at room temperature is 1 kg/20 mm width or higher. Preferably, a pressure-sensitive adhesive composition comprising a polymer having a polycarbonate structure having a repeating unit represented by the following formula

Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets made therefrom, and sealants, reinforcing sheets and pressure-sensitive adhesive sheets for printing produced therefrom

A pressure-sensitive adhesive composition with a pressure-sensitive adhesive property and heat resistance comprises a polyester having a polylactone structure as the main chain. A pressure-sensitive adhesive sheet with a releasing property of a peelable liner and containing no silicone can be obtained by using the pressure-sensitive adhesive composition in combination with a polyolefin film without being subjected to a silicone treatment as a peelable liner. When the pressure-sensitive adhesive sheet comprises a base material having formed thereon the layer of the pressure-sensitive adhesive composition and the back side of the base material has a surface composed of a polyolefin, neither a peelable liner nor a silicone treatment is required. The pressure-sensitive adhesive sheet is suitably used for computer instruments etc., because it contains no silicone.

Pressure-sensitive adhesive composition and pressure-sensitive adhesive

An improved process for preparing a 4-mercaptopyrrolidine compound [I]: ##STR1## wherein R is H, lower alkyl or lower alkanoyl, R.sup.1 is H or SH-protecting group, and X is O or S, which comprises reacting halogenobutyric acid compound [VI], or a salt thereof, with amine compound [VII], or a salt thereof, and if necessary, followed by thiocarbonylating the product and/or removing the protecting group, said 4-mercaptopyrrolidine compound [I] being useful as intermediate for carbapenem antibacterial agents.

Process for preparing 4-mercaptopyrrolidine intermediate compounds and a

A foam substrate-attached adhesive sheet or tape comprising a substrate having formed thereon a layer of a pressure-sensitive adhesive, wherein the substrate is a foam elastomer having a breaking elongation of at least 800% and an apparent 800% modulus of from 1.0 to 15 kg/cm.sup.2 in a tensile test of 23.degree. C., and a breaking elongation of at least 400% and an apparent 400% modulus of from 2.0 to 60 kg/cm.sup.2 in a tensile test of -30.degree. C.

Foam substrate-attached adhesive sheets

A pressure-sensitive adhesive and adhesive sheets using the pressure-sensitive adhesive are disclosed. The pressure-sensitive adhesive comprising (a) from 50 to 84% by weight of an acrylic monomer, (b) from 15 to 28% by weight of an N,N-di-substituted (meth)acrylamide, (c) from 1 to 10% by weight of a monomer having an acid group, and (d) from 0 to 25% by weight of other monomer copolmerizable with the components (a) to (c).

Pressure-sensitive adhesive and adhesive sheets using the same

An expoxy resin composition, an epoxy resin cured product obtained therefrom, and a bonding method using the composition are disclosed. The epoxy resin composition comprises an epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, said components (A), (B) and (C) being present in a phase separation state.

Epoxy resin composition, cured product obtained therefrom, curing method

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Osaka, Japan

Takeshi Yamanaka