Koki Company Limited

Takeshi Yahagi

Noriyoshi Uchida

Tatsuya Baba

Yuri Misumi

Motohide Sasaki

Mitsuyasu Furusawa

Koichi Sekiguchi

Kazuhiro Yukikata

Kazuma Karube

Yusuke Satoh

A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

Flux and solder paste

Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.

Resin composition for reinforcement and electronic component device

A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.

Flux and solder composition

Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.

Growing community of inventors

Tokyo, Japan

Takeshi Yahagi