International Business Machines Corporation

Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Plant Technologies, Ltd.

Takeshi Tsukamoto

Masanori Miyagi

Roger R Schmidt

Takashi Naito

Takuya Aoyagi

Tadashi Fujieda

Hajime Murakami

Shinichi Tachizono

Motomune Kodama

Yuichi Sawai

Yuji Hashiba

Kei Yoshimura

Hirotsugu Kawanaka

Tetsuya Kuwano

Yoshihisa Maeda

Hiroshi Suzuki

Hiromi Kobayashi

Kunio Miyazaki

Masaaki Iwasa

Ryujiro Udo

Hideto Nogiwa

Akira Suzuki

Jyunji Takayoshi

Katsushi Tanaka

Michael J Ellsworth, Jr

Robert E Simons

Richard C Chu

Takahiko Kato

Hisanori Okamura

Donald W Porter

Masahisa Inagaki

Yoshinori Inoue

Hiroyuki Takenoshita

Joseph P Corrado

Taiji Hashimoto

Yasuharu Yamada

Steven J Mazzuca

Yohichi Matsui

Masato Koshiishi

Masaaki Imai

Takeshi Obana

Masayoshi Funatsu

Junji Takayoshi

Shinji Imaoka

John F Eberth

Minoru Onai

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2265;90 (mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

Electronic component, method for producing same, and sealing material paste used in same

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2267;90(mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5&#xd7;10/&#xb0; C. or less in a temperature range from 30 to 250&#xb0; C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Electronic component, process for producing same, sealing material paste, and filler particles

An electronic system includes an electronic system cabinet housing at least one electronic system component and a power generation system. The power generation system includes a cooling system having a cooling medium that generates a cooling energy. The power generation system further includes a thermoelectric conversion element having a first side and a second side. The first side is in a heat exchange relationship with the at least one electronic system component and the second side is in a heat exchange relationship with the cooling medium. Heat energy generated by the at least one electronic system component raises a temperature of the first side and the cooling energy generated by the cooling medium lowers a temperature of the second side to establish a temperature difference. The thermoelectric conversion element produces an electro-motive force based on the temperature difference.

Generating power from heat produced by an electronic system

A laser processing system includes a laser processing head, a powder supply device, and a controller. The powder supply device supplies powder to the laser processing head. The laser processing head includes: a laser emission unit which irradiates a workpiece with laser light; and a powder supply unit which receives the powder supplied from a powder supply device to the laser processing head, and can supply the powder to a laser spot on the workpiece. The powder supply unit includes: a powder discharge unit which can discharge the powder toward the laser spot on the workpiece; and a powder-supply control mechanism which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device. The controller controls the distributing by the powder-supply control mechanism.

Laser processing system and overlay welding method

A laser processing head in accordance with the present invention comprises: a laser emitting unit for irradiating a workpiece with a laser light; and a powder feeder disposed around a periphery of the laser emitting unit for discharging filler material powder to the workpiece, in which the powder feeder includes: a position adjustment mechanism for adjusting a position where the powder concentrates; and a powder concentration diameter adjustment mechanism for adjusting a diameter of the filler material powder. The laser processing head further comprises a controller for controlling the position adjustment mechanism and the powder concentration diameter adjustment mechanism.

Laser processing head and laser cladding method

A welding apparatus and a welding method are employed for laser narrow groove welding which performs welding scanning a laser beam in the welding direction while feeding a solid filler metal into a narrow groove. The welding apparatus includes a laser beam irradiation head having a mechanism periodically oscillating an irradiation point of the laser beam with a predetermined amplitude in the bottom of the groove, and a filler metal control device having a solid filler metal feeder feeding the solid filler metal to the molten pool formed in the bottom of the groove by the laser beam and adjusting the feeding position independent of a motion of the laser beam irradiation head so that the tip position of the solid filler metal detected is constantly positioned in the center of the groove.

Laser narrow groove welding apparatus and welding method

A welding method for an impeller having a plurality of blades, a disc and an exterior body including a shroud welded to the plurality of blades, comprising the steps of:

Welding method and welding apparatus for an impeller

Blades are connected to the surface of a disk and slots are formed in the surface of a shroud, which is opposite from the other surface of the shroud where the blades are to be welded. The blades are arranged on the opposite surface from the slots and a laser beam is applied from the surface in which the slots are formed, to weld the shroud and the blades. Components are installed on the surfaces of the slots on the opposite side from the blades after the blades and the shroud in which the slots are formed are welded. Alternatively, the slots are filled with a material different from that of the shroud, such as a resin. With this configuration, distortion caused by welding heat can be reduced without degrading the fluid performance.

Welding slot sealing structure and welding method

A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.

Facilitating cooling of an electronics rack employing water vapor compression system

A vapor-compression heat exchange system for facilitating cooling of an electronics rack. The system includes employing an evaporator coil mounted to an outlet door cover, which is hingedly affixed to an air outlet side of the rack, as well as refrigerant inlet and outlet plenums and an expansion valve also mounted to the outlet door cover and in fluid communication with the evaporator coil. The evaporator coil includes at least one heat exchange tube section and a plurality of fins extending therefrom. Respective connect couplings connect the inlet and outlet plenums in fluid communication with a vapor-compression unit which includes a compressor and a condenser disposed separate from the outlet door cover. The vapor-compression unit exhausts heat from refrigerant circulating therethrough.

Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack

A cooling system is provided employing at least two modular cooling units (MCUs). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger, with the portion being controlled by the at least one control valve. The second cooling loop provides cooled system coolant to the multiple electronics subsystems, and expels heat in the heat exchanger from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop. The at least one control valve allows regulation of facility coolant flow through the heat exchanger, thereby allowing control of temperature of system coolant in the second cooling loop.

Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems

A modular fluid unit for cooling heat sources located on a rack, the modular fluid unit comprising: a heat exchanger in fluid communication a pump; and wherein the modular fluid unit is mountable within the rack and is configurable to be in fluid communication with a cold plate return manifold, a cold plate supply manifold, and an end-user fluid supply. A method for cooling electronic components in a rack, the method comprising: circulating a first liquid from a cold plate to one of a plurality of heat exchangers mounted within the rack; circulating a second liquid from a second liquid supply to the one of a plurality of heat exchangers; and transferring heat from the first liquid to the second liquid at the one of a plurality of heat exchangers.

Method and apparatus for cooling electronic components

In a joining method for manufacturing a rotor blade by joining a plurality of members, the members are pressed so as to exert a predetermined pressure on the bonding interface. A pulse voltage is applied to the members to pass electric current therethrough, and the joint portion is heated by resistance heating generated at the bonding interface and in the bulk of the members to cause diffusion bonding and thereby to join the members to each other. With this method, good joining can be achieved without substantially changing the crystal structure and mechanical properties of the base metals.

Method for manufacturing turbine blade and manufactured turbine blade

Provided are an underwater processing apparatus which can effectively prevent water from entering a shield for a workpiece having a surface ruggedness, and in which variation in a gas flow for a processing part is reduced, a processing method and an application thereof to a nuclear reactor, and the under water processing device is composed of a shield means which locally cover the processing part with the gas in order to prevent water from entering the shield member, the shield means having a solid wall formed of a member which is slidable in a part where it make contact with the workpiece, and adapted to make contact with the workpiece and to be moved up and down by a pressing force, and a water jetting means for forming a water curtain around the outer periphery of the solid wall.

Underwater processing device and underwater processing method

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Tokyo, Japan

Takeshi Tsukamoto