Tokyo Electron Limited

Takeshi Tsukamoto

Mitsuhiro Sakai

Kiyomitsu Yamaguchi

Yoichi Honda

Fumio Satou

Tetsuya Sada

Kiyohisa Tateyama

Kimio Motoda

Yoshitaka Matsuda

Tetsu Kawasaki

A method for a cleaning treatment including a step of forming, in a coating mechanism, a coating film on a substrate provided within a cup. The method further includes dissolving, in an edge cleaning mechanism, a portion of the coating film on the substrate using a cleaning liquid, and recovering at least a portion of used cleaning liquid from the edge cleaning mechanism. The recovered cleaning liquid is stored and a level of the stored cleaning liquid is detected. The method also includes supplementing a fresh cleaning liquid to the stored cleaning liquid when a detected level of the stored cleaning liquid is lower than a predetermined level, and using a mixture of the supplemented fresh cleaning liquid and the stored cleaning liquid to clean the cup of the coating mechanism.

Method and apparatus for cleaning treatment

An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

A method of processing a substrate for removing a coating film from a substrate by dissolving the coating film with a solvent, comprising the steps of (a) supplying a solvent independently to each of peripheral portions of an upper surface side and a lower surface side of the substrate, and (b) supplying the solvent to the peripheral portion of the lower surface side of the substrate in an amount lower than the solvent supplied to the peripheral portion of the lower surface side in the step (a) or lower than that supplied to the peripheral portion of the upper surface side in this step (b), or terminating a supply of the solvent.

Method and apparatus for processing substrate

Growing community of inventors

Kikuchi-gun, Japan

Takeshi Tsukamoto