Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Takeshi Tokuyama

Kinya Nakatsu

Toshiya Satoh

Ryuichi Saito

Nobutake Tsuyuno

Yusuke Takagi

Hideki Miyazaki

Keisuke Horiuchi

Hiroshi Hozoji

Tokihito Suwa

Takanori Ninomiya

Eiichi Ide

Akira Matsushita

Taku Oyama

Takashi Hirao

Takahiro Araki

Toshiaki Ishii

Masahiro Hori

Junpei Kusukawa

Masanori Sawahata

Hideaki Ishikawa

Atushi Kawabata

Noriyuki Maekawa

Shinichi Fujino

Takahiro Shimura

Akihiro Namba

Morio Kuwano

Shinji Hiramitsu

Masashi Yura

Mina Amo

Hiroyuki Temmei

Isao Yoshida

Toshiyuki Ajima

Noriaki Hino

Kaoru Uchiyama

Takafumi Hara

Takahide Ikeda

Shigehisa Aoyagi

Masami Ohnishi

Shigeru Nishimatsu

Atsushi Kawabata

Shigeo Amagi

Hiroshi Kamizuma

Yukio Hattori

Akira Mima

Takaki Itaya

Kyoshiro Itakura

Kazuaki Naoe

Yuujiro Kaneko

Ryuuichi Saitou

Shun Kawano

Kyota Asai

Ti Chen

Hideaki Goto

A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

Power semiconductor device

A motor control device connected to a power converter that performs power conversion from DC power to AC power and controls driving of an AC motor that is driven by using the AC power includes a voltage command generation unit that generates a three-phase voltage command; and a gate signal generation unit that performs pulse width modulation on the three-phase voltage command and generates a gate signal for controlling an operation of the power converter, in which the voltage command generation unit adjusts the three-phase voltage command by using a zero-phase voltage based on a power factor of the AC power in an overmodulation region in which a modulation factor according to a voltage amplitude ratio between the DC power and the AC power exceeds a predetermined threshold value, and the gate signal generation unit generates the gate signal by performing pulse width modulation on the adjusted three-phase voltage command.

Motor control device, electromechanical integrated unit, boost converter system, electric vehicle system, and motor control method

A power module includes a power semiconductor element converting DC power into AC power and outputting the AC power to a motor; a conductor electrically connected to the power semiconductor element; a substrate having a substrate wiring connected to the conductor on a surface; and a resin sealing material sealing the power semiconductor element, the conductor, and the substrate. The substrate has, at a position in contact with an end portion of the resin sealing material, a concave portion formed by a surface of the substrate wiring becoming concave in a continuously curved surface shape.

Power module and power conversion device using the same

A power semiconductor device according to the present invention is provided with a conductive section, a circuit component, a substrate that supports the conductive section and the circuit component, and a sealing member, wherein the sealing member forms a first flow path, and the first flow path has a first region thermally connected to a power circuit and a second region thermally connected to the circuit component.

This power conversion device comprises: first and second power circuit units each having a power semiconductor element and a plurality of conductors that hold the power semiconductor element therebetween and that are connected to an emitter and a collector of the power semiconductor element; and a flow channel forming body which houses the first and second power circuit units and through which a refrigerant flows. A conductor at the emitter side of the first power circuit unit is disposed so as to face a conductor at the collector side of the second power circuit unit. The conductor at the emitter side of the first power circuit unit and the conductor at the collector side of the second power circuit unit are connected to each other via a plurality of conductive fins which are in contact with the refrigerant.

Power conversion device with refrigerant

An object of the present invention is to provide an inverter integrated motor that achieves both improvement in cooling performance of a current sensor and downsizing of an entire device. An inverter integrated motor includes: a power module that converts a direct current into an alternating current; a flow path forming body that is formed so as to flow and cover a refrigerant in the power module; an inverter that installs the power module and the flow path forming body inside; a current sensor that detects the alternating current; and a motor that houses a stator and a rotor, wherein the power module is disposed at a position facing a rotation shaft of the motor via the stator and the rotor, and the current sensoris disposed between the flow path forming body and a coil end of the stator when viewed from a direction perpendicular to the rotation shaft, and at least a part of the current sensor is housed in a motor housing.

Inverter integrated motor

An object of the present invention is to provide a structure capable of stably holding a bonded magnet into a magnet insertion part of a rotor core. A rotor of a rotating electrical machine includes a bonded magnet, an elastic memberhaving a bent part, and a rotor core provided with a magnet storage part storing the bonded magnetand the elastic member. The elastic memberis embedded in the bonded magnetin a state where at least a part of the bent partis exposed from the bonded magnet, and an exposed partof the bent partfrom the bonded magnetcomes into contact with an inner wall of the magnet storage partand elastically deforms.

Rotor of rotating electrical machine and electrical drive system

An object of the present invention is to improve cooling capability of a bus bar with a simple system. An electric system includes a motor unit including a stator and a rotor, the motor unit being cooled by a refrigerant, an inverter unit that supplies electric power to a winding of the stator, a wiring portion that transmits electric power output from the inverter unit to the motor unit, and a pipe that supplies or discharges a refrigerant to or from the motor unit. The pipe is provided at a position at which the wiring portion can exchange heat with an oily medium cooled by the pipe.

Electric system for cooling a motor and inverter unit

A power conversion device can be miniaturized. A power conversion device includes a power module that performs switching operation, a smoothing capacitor that smooths a voltage ripple caused by the switching operation, a circuit board that controls driving of the power module, a housing that accommodates the power module and the smoothing capacitor, a first fixing member for fixing the power module to the housing, and a second fixing member for fixing the smoothing capacitor to the housing. The circuit board straddles between the power module and the smoothing capacitor, and is fixed by the first fixing member and the second fixing member.

Power conversion device

No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module () is transferred to a bus bar module () via a DC terminal (A) of the semiconductor module (). As illustrated in FIG.(B), the heat transferred to the bus bar moduleis then transferred to the pressing membervia the annular conductorand the boltA. Since the pressing memberis in close contact with the second coolerB, the heat transferred to the pressing memberis cooled by the second coolerB. On the other hand, the heat transferred to the convex portionA of the housingis transferred to the first coolerA via the housingand cooled. As a result, in the configuration in which a capacitor () is connected to the semiconductor module () via the bus bar module (), the heat transferred from the semiconductor module () to the capacitor () can be suppressed.

Power conversion device and motor-integrated power conversion device

There is a problem that the reliability of insulation is lowered. A length Lfrom a center P of a conductor layerto a peripheral edge portion of an insulating memberis formed to be longer than a length Lfrom the center P of the conductor layerto a peripheral edge portion of a protruding portionof a base member. In other words, a base end surfaceof the peripheral edge portion of the protruding portionis located on an inner side with respect to an insulating member end surfaceof the peripheral edge portion of the insulating member. Further, the insulating member end surfaceof the insulating memberand a conductor layer end surfaceof the conductor layer form an end surface at the same position. Since the base end surfaceof the peripheral edge portion of the protruding portionis located on the inner side with respect to the insulating member end surfaceof the peripheral edge portion of the insulating memberin this manner, an insulation distance can be secured.

Semiconductor device with a protruding base member

A power module includes a double-sided electrode module, a power semiconductor element, a pair of base plates, and a connecting member. The double-sided electrode module has a plurality of electrode wiring boards and a power semiconductor element which are molded with a resin material. The pair of base plates has the double-sided electrode module sandwiched therebetween. The pair of base plates are connected via the connecting member. The connecting member is formed in a curved shape.

Power module, power converter device, and electrically powered vehicle

An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Electric power conversion apparatus

Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit. A DC positive electrode terminal, a DC negative electrode terminal, and an alternating current terminalof a semiconductor chip are disposed in the semiconductor module. The DC terminalsandare electrically connected with a terminal of a capacitor module. The alternating current terminalis electrically connected with a motor generator via an AC connector.

Power conversion apparatus

An object of the present invention is to provide a structure, particularly, a power semiconductor module, which suppresses a bypass flow of a cooling medium and improves cooling efficiency. A structure according to the present invention includes a heat dissipation plate thermally connected to a heating element, and a resin region having a resin material that fixes the heating element and the heat dissipation plate, wherein the heat dissipation plate includes a fin portion including a plurality of fins protruding from a heat dissipation surface of the heat dissipation plate and formed to be exposed from the sealing resin material, and a wall portion formed to protrude from the heat dissipation surface to a same side as the fin and which separates the fin portion and the resin region.

Power semiconductor module with heat dissipation plate

Growing community of inventors

Hitachi, Japan

Takeshi Tokuyama