Other

Takeshi Tokusho

Fumio Murayama

Yasuhisa Abe

Takashi Suzuki

Toshihiro Ishigaki

A method for manufacturing a speaker apparatus that includes fixing a magnetic circuit to a frame so that the magnetic circuit is positioned around a central hole of the frame; positioning a coil with respect to a center pole of the magnetic circuit; connecting a damper to the coil and the frame; positioning a jig in the central hole of the frame; projecting the jig from a center hole of the center pole; engaging a positioning portion provided on a diaphragm with the jig to position the diaphragm at a predetermined position with respect to the center pole, the positioning portion being removably connected with the jig positioned in the central hole of the frame to secure the position of the diaphragm relative to the magnetic circuit during the installation; and connecting the positioned diaphragm to the coil and the frame.

Method for manufacturing a speaker apparatus

A speaker system and a cooling device therefor is provided which is capable of effectively dissipating heat generated by a voice coil. The cooling device is formed as a unitary member having a first member having a hollow cylindrical shape which is integrally formed with a second member having a hollow cylindrical shape which is concentric thereto and has a larger diameter than the first member, and a plurality of third members each in the form of a plate and radially arranged between the first member and the second member for connecting the members. The first member is arranged adjacent to the voice coil and at the same time inside a magnetic flux loop generated by a magnetic circuit, and the second member is arranged outside the magnetic flux loop, so that heat generated by the voice coil can be efficiently dissipated from the second member.

Speaker system and cooling device therefor

A conductive damper for use in a speaker is provided, the endurance and the moldability of which are improved. A base is moved downward to allow an inner top mold to abut on a bottom mold, then the base is further moved downward to allow the inner top mold and the bottom mold to be applied pressure and the base moves down with being guided by guiding means. At this time, energizing means energizes the inner top mold to press the bottom mold, thereby corrugations for the inner part of a workpiece of the conductive damper are molded. At this time, the workpiece of the conductive damper is pulled toward the inner side thereof. Then, the base is further moved downward to press an outer top mold onto the bottom mold, thereby corrugations for the outer part of the workpiece of the conductive damper are molded.

Process for processing a conductive damper for use in speaker

A speaker apparatus includes a frame having a magnetic circuit, a voice coil bobbin installed in the frame to be magnetically coupled to the magnetic circuit, and a diaphragm movably installed in the frame and fixed to the voice coil bobbin so as to be driven by activating the magnetic circuit. The diaphragm has a positioning portion that had been used for securing the diaphragm relative to the magnetic circuit during an installation of the diaphragm in the frame.

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Yamagata, Japan

Takeshi Tokusho