Toppan Inc.

Hewlett-packard Company

Nippon Steel & Sumitomo Metal Corporation

Lumileds Lighting U.s., LLC

Nippon Steel & Sumikin Coated Sheet Corporation

Takeshi Tamura

Takashi Fujita

Shinichi Saito

Takeshi Imai

Kazuhiro Miyamoto

Seiji Sugiyama

Tetsuyuki Tsuchida

Tetsuya Shiraishi

Takaaki Yagi

Yuki Nitta

Masashi Sawadaishi

Fusanori Arakane

Mitsuo Nishimata

Keiichi Nagakusa

Yasushi Yamane

A wiring board capable of suppressing migration between wires and to provide a method of producing the same, in a method of producing a wiring board provided with a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board is formed by performing steps of forming a first insulating resin layer provided with a wiring pattern and openings, forming a first inorganic insulating film on the first insulating resin layer, forming a first conductor layer corresponding to the wiring pattern and the openings on the inorganic insulating film, and forming a second inorganic insulating film on the first conductor layer.

Wiring board and method of producing wiring board

There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.

Method of producing circuit boards

A wiping device which blows a wiping gas toward a steel sheet from a pair of wiping nozzles disposed on both sides of the steel sheet so as to face sheet surfaces of the steel sheet, wherein the steel sheet is interposed between the pair of wiping nozzles and is pulled from a hot dip coating bath, the device includes a suctioning tube, wherein: the suctioning tube is disposed on both sides in a width direction of a section of the steel sheet, the section being positioned between the pair of wiping nozzles, so that the suctioning tube is in parallel to the steel sheet; the suctioning tube has a suctioning port that suctions an air; the suctioning port is disposed to face a side end surface of the steel sheet; a cross-sectional shape of the suctioning tube has the largest dimension thereof along a pulling direction of the steel sheet.

Wiping device and hot dip coating apparatus using the same

A light-emitting device comprises a substrate, electrical terminals disposed on a top side of the substrate, and a light-emitting semiconductor device disposed above the substrate. The light-emitting semiconductor device has a bottom side oriented to face toward the top side of the substrate. Electrodes are disposed on the bottom side of the light-emitting semiconductor device and electrically connected to the terminals on the substrate. A glass layer is arranged in a path of output light emitted by the light-emitting semiconductor device. The glass layer contains fluorescent material that converts at least a portion of the output light to converted light having a wavelength different from a wavelength of the output light. The fluorescent material may include SrS:Eu that emits red light and (Sr, Ba, Ca)Ga S :Eu that emits green light.

Light-emitting device and production thereof

A cam mechanism is provided in a DUT board mounting portion of a test head which includes a cam shaft having a guide pin connected to an actuator and a driven ring having a sloped groove along which the guide pin is guided, and a second guide pin provided on an outer cylindrical surface of the driven ring which is guided along a substantially L-shaped cam groove formed in a cylindrical opening of the DUT board mounting portion of the test head. When the second guide pin is located on a horizontal portion of the L-shaped cam groove, the driven ring is inhibited from moving downwardly but is rotated together with the cam shaft so that an engaging member of the driven ring is caused to engage with the DUT board. When the second guide pin reaches a vertical portion, only the cam shaft is rotated, and the driven ring moves downwardly along the vertical portion of the L-shaped groove to urge the DUT board assembly against contact probes on the test head assembly.

Mechanism for removably mounting dut board on test head

Growing community of inventors

Tokyo, Japan

Takeshi Tamura