Nichia Corporation

Takeshi Tamura

Motokazu Yamada

Hiroshi Fujimori

Yuichi Yamada

Atsushi Yamamoto

Yasuo Fujikawa

Shinsaku Ikuta

Tomonori Ozaki

Shinya Kondo

Hiroaki Shozui

A planar light source includes: a plurality of light sources disposed two-dimensionally, each including: a light-emitting element, a light-transmissive member covering the light-emitting element, and a light adjustment member disposed on an upper surface of the light-transmissive member and located above the light-emitting element. The plurality of light sources include, in a top view, a plurality of central light sources disposed in a central region, and a plurality of peripheral light sources disposed in a peripheral region located outward of the central region. The plurality of peripheral light sources include a first light source in which a light transmittance of the light adjustment member is higher than a light transmittance of the light adjustment members of the central light sources.

Planar light source and liquid crystal display device

An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

LED package and integrated light emitting device

A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

Light emitting module and liquid crystal display device

A light emitting device includes: a mounting board; a light source positioned on the mounting board; a light diffusion plate; a diffuse reflector positioned between the mounting board and the light diffusion plate, and above at least part of an emission face of the light source; and a wavelength conversion layer positioned on or above the diffuse reflector.

Light emitting device

A light source device includes a substrate, a plurality of light sources arranged on the substrate, a light transmissive member arranged over the light sources, and a light-reflecting pattern. The light-reflecting pattern is arranged above or below the light transmissive member such that a thickness and/or a concentration of material of the light-reflecting pattern in a first region directly above one of the light sources is greater than the thickness and/or the concentration of material of the light-reflecting pattern in a second region above a portion between adjacent ones of the light sources.

Light source device

A light emitting device includes: a base; a phosphor frame positioned inward of edges of a lower face of the base; a light emitting element disposed in an area surrounded by the phosphor frame; and a light transmissive member contacting at least a portion of the edges of the lower face of the base and at least a portion of outer lateral faces of the phosphor frame.

Light emitting device, method of manufacturing light emitting device, planar light source, and liquid crystal display device

A light-emitting device includes: a light-emitting element having an upper surface, and including a plurality of semiconductor light-emitting structures; and a substrate supporting the light-emitting element. The semiconductor light-emitting structures include a first semiconductor light-emitting structure and a second semiconductor light-emitting structure. The substrate includes: an interconnection layer including: a first interconnection portion comprising a first land, a second interconnection portion comprising a second land and a third land, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer and having an opening. The light-emitting element is located inside the opening of the first reflective member as viewed from above. A portion of the first land, a portion of the second land, a portion of the third land, and a portion of the fourth land are exposed in the opening of the first reflective member.

Light-emitting device

A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; first and second prism array layers stacked with each other; a dichroic layer positioned between the first and second prism array layers and the plurality of light sources; and a wavelength conversion layer positioned between the first and second prism array layers and the dichroic layer.

A light emitting device includes a substrate, a plurality of light sources, a partitioning member and a diffuser sheet. The light sources are disposed on an upper surface of the substrate. The partitioning member is disposed on the upper surface of the substrate and including top parts. The partitioning member is reflective. The diffuser sheet is in contact with the top parts of the partitioning member.

A method of manufacturing a light emitting device includes: providing a first member comprising: a base, a plurality of phosphor frames positioned on the base, the plurality of phosphor frames including a first phosphor frame and a second phosphor frame that is adjacent to the first phosphor frame, and a light transmissive member, a portion of which is disposed between the first phosphor frame and the second phosphor frame; disposing a first light emitting element in the first phosphor frame and a second light emitting element in the second phosphor frame, wherein: each light emitting element has an emission face and an electrode forming face located opposite to the emission face, each light emitting element comprises an electrode located on its electrode forming face, and each light emitting element is disposed such that its emission face faces the base; and cutting the light transmissive member.

A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

Light emitting device including light transmissive cover member including an annular lens part, and LED package

A light-emitting device has a light-emitting element including first and a second semiconductor light-emitting structures, each having a first and a second electrode, and a substrate supporting the light-emitting element. The substrate has an interconnection layer having a first interconnection portion comprising a first land, a second interconnection portion comprising second and third lands, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer. A portion of the first land is coupled to the first electrode of the first semiconductor light-emitting structure. A portion of the second land and a portion of the third land are coupled to the second electrode of the first semiconductor light-emitting structure and the first electrode of the second semiconductor light-emitting structure, respectively. A portion of the fourth land is coupled to the second electrode of the second semiconductor light-emitting structure.

A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources. The diffuse reflectors comprise a resin, and particles dispersed in the resin. Each of the diffuse reflectors is positioned in an area that, in the top view, is larger than and includes the emission face of each light source. A density of the particles in said area, in the top view, is higher in a first portion located immediately above the emission face of each light source than in a second portion located around a periphery of the first portion.

A light emitting device includes a plurality of light sources, a substrate, a partitioning member, a diffuser sheet, a plurality of first reflectors, and a second reflector. Each of the light sources includes a light emitting element and an encapsulant covering the light emitting element. The light sources are disposed on the substrate. The partitioning member surrounds the light sources and has a plurality of areas formed by walls having top parts. The walls include surfaces inclined with respect to an upper surface of the substrate to spread out from bottom parts toward the top parts. The diffuser sheet is provided over the partitioning member. The first reflectors are provided directly over the light sources, on an upper surface or a lower surface of the diffuser sheet. The second reflector is provided directly over the top parts, on the upper surface or the lower surface of the diffuser sheet.

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Anan, Japan

Takeshi Tamura