Kuraray Co., Ltd.

Takeshi Takahashi

Minoru Onodera

Takahiro Nakashima

Tatsuya Sunamoto

Tetsuya Hara

Masataka Shintani

Provided are a metal clad laminate and a method for producing the same. The metal clad laminate at least includes a thermoplastic liquid crystal polymer film and a metal sheet bonded to each other, wherein the thermoplastic liquid crystal polymer film has a surface with a glossiness (20°) of 55 or higher in accordance with JIS Z 8741 on the opposite side of the bonding surface to the metal sheet. The method for producing a metal clad laminate at least includes: providing a thermoplastic liquid crystal polymer filmand a metal sheet; and introducing the thermoplastic liquid crystal polymer filmand the metal sheetbetween a pair of heating rolls so as to laminate them.

Metal clad laminate and production method thereof

Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.

Thermoplastic liquid crystal polymer film and circuit board using same

A method for manufacturing a metal-clad laminate sheet including forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and providing the laminate sheet with a heat treatment which satisfies conditions (1) and (2) below: (1) a heat treatment temperature ranges between 1&#xb0; C. inclusive and 50&#xb0; C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film. (2) a time for the heat treatment ranges from one second to 10 minutes.

Metal-clad laminate sheet manufacturing method, and metal-clad laminate sheet using the same

Provided is a method for producing a metal-clad laminate of a thermoplastic liquid crystal polymer film (TLCP film) and a metal sheet(s) bonded to at least one surface of the film using roll-to-roll processing. The metal sheet has a surface with a ten-point average roughness (Rz) of 5.0 &#x3bc;m or less to be bonded to the TLCP film. The method includes preparing the laminate, dry-treating the laminate by subjecting the laminate passed through a dry zone satisfying the following conditions (1) and (2): heat-treating the dried laminate by subjecting the laminate passed through a heating zone on a temperature condition of not lower than the melting point of the TLCP film successively after the dry treatment.

Method for producing metal-clad laminate, and metal-clad laminate

Provided are a thermoplastic liquid crystal polymer film having an improved thermo-adhesive property, a circuit board, and methods respectively for producing the same. The thermoplastic liquid crystal polymer film has a segment orientation ratio SOR of 0.8 to 1.4 and a moisture content of 300 ppm or less. The circuit board contains a plurality of circuit board materials wherein the circuit board materials are at least one member selected from the group consisting of an insulating substrate having a conductor layer on at least one surface, a bonding sheet, and a coverlay. At least one of the circuit board materials includes a thermoplastic liquid crystal polymer film. The circuit board shows a solder heat resistance when the circuit board is placed in a solder bath at 290&#xb0; C. for 60 seconds in accordance with JIS C 5012.

Thermoplastic liquid crystal polymer film, circuit board, and methods respectively for manufacturing said film and said circuit board

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

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Kamisu, Japan

Takeshi Takahashi