Seiko Instruments Inc

Sii Printek Inc.

Sony Corporation

Takeshi Sugiyama

Hitoshi Nakayama

Daichi Nishikawa

Eriko Maeda

Kiyoshi Aratake

Keiji Sato

Masashi Numata

Takahiko Nakamura

Hitoshi Takeuchi

Junya Fukuda

Kazuto Kitakubo

Daisuke Terada

According to an embodiment, an ink jet head (liquid ejecting head) includes an actuator plate and a cover plate (see FIG.). As illustrated in FIG., channel grooves for a discharge channel (ejection channel) and a non-discharge channel (non-ejection channel) in a Z-direction are formed on a front surface of the actuator plate, so as to be alternately arranged in an X-direction, by cutting with a dicing blade or the like. The discharge channel and the non-discharge channel are formed to have a groove width W of smaller than 70 &#x3bc;m, in order to correspond to high density of nozzles. In the embodiment, the discharge channel and the non-discharge channel are formed to have a groove width of 55 &#x3bc;m, 50 &#x3bc;m, or 40 &#x3bc;m, for example.

Liquid ejecting head chip, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head chip

A discharge channel and a non-discharge channel are formed to have a similar shape, that is, to include extension portions and raise-and-cut portions continuing from end portions of both the extension portions, respectively. Then, imparting of a catalyst, washing of an unnecessary catalyst, plating, and the like are performed on a target surface, as a plating step. In an embodiment, an electrode clearance groove is formed after the plating step. Since channel grooves for the discharge channel and the non-discharge channel have a similar shape, it is possible to cause a water flow to uniformly flow in the channels when washing is performed, and thus to avoid an occurrence of a situation in which a lump is formed in the channel groove by plating.

Manufacturing method of liquid ejecting head chip

Channel grooves for a discharge channel and a non-discharge channel are formed in the surface of an actuator plate by cutting. The discharge channel includes an extension portion and a raise-and-cut portion, and the non-discharge channel also includes an extension portion and a raise-and-cut portion. In an embodiment, an electrode clearance groove is formed in advance by cutting with a dicing blade or the like. After the electrode clearance groove is formed, an electrode is formed by plating. Since plating is performed after the electrode clearance groove is formed, a clearance groove electrode is integrally formed with an AP-side common pad in the electrode clearance groove, and thus the clearance groove electrode and the AP-side common pad are short-circuited. Thus, an electrode separation portion is formed by cutting a short-circuited portion of the clearance groove electrode and the AP-side common pad through cutting or irradiation with laser.

A package manufacturing method where a base substrate and a lid substrate, at least one having a through-hole, are anodically bonded to each other using a jig having a communication-hole and arranged in a vacuum chamber to laminate the lid substrate to the base substrate and thereby form a bonded body having a plurality of cavities, each of which includes an electronic part sealed therein. The through-hole and the communication-hole are aligned with each other inside the vacuum chamber, such that gas within the cavities can escape through the through-hole and the communication-hole during bonding. A plurality of packages are formed by cutting the bonded body for every one of the plurality of cavities.

Manufacturing method of package

Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material and a base board wafer even when the bonding material having a large resistance value is used. Providing a method for manufacturing a package by anodically bonding a bonding material, which is fixed in advance to an inner surface of a lid board wafer made of an insulator, to an inner surface of a base board wafer made of an insulator, the method including an anodic bonding step where an auxiliary bonding material serving as an anode is disposed on an outer surface of the lid board wafer, a cathode is disposed on an outer surface of the base board wafer, and a voltage is applied between the auxiliary bonding material and the cathode, wherein the auxiliary bonding material is made of a material that causes an anodic bonding reaction between the auxiliary bonding material and the lid board wafer in the anodic bonding step.

Method of manufacturing piezoelectric vibrators

Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid boardis superimposed onto an inner surface of the base board, and an outer surface of the base boardis disposed on an electrode base portionfor anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding filmand the electrode base portionwhile heating them to a bonding temperature, whereby the bonding filmand the base boardare anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodesare exposed to a void portionformed in the electrode base portion

Method for manufacturing piezoelectric vibrator

A package includes a plurality of bonded substrates including a first substrate and a second substrate defining a cavity therebetween. A first bonding film resides on opposed surfaces of the first substrate and the second substrate so as to surround the cavity. The second bonding film surrounds the cavity and resides on the opposed surfaces of the first and second substrates adjacent to the first bonding film. The second bonding film has a bonding force stronger than the first bonding film and the ionization resistance of the first bonding film is greater than the ionization resistance of the second bonding film.

Package

A wafer is provided that is stacked on and anodically bonded to another wafer to form a plurality of package products each having a cavity in which an operation piece is contained between the wafers. The wafers has a product area in which a plurality of concave portions are formed each of which will be part of the cavity when stacked on the another wafer, and grooves or slits are formed extending from the central portion in radial direction to the outside in radial direction of the wafer and reaching the outside of the product area.

Wafer and package product manufacturing method

To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component () is formed by bonding together a base () made of glass and a lid (). Outer electrodes () and () are formed on a bottom surface of the base (), and the outer electrodes () and () are respectively connected to through electrodes () and (). The outer electrodes () and () each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes () and () are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Electronic component and electronic device

This piezoelectric vibrator is provided with a package that is structured to include a first substrate and a second substrate that are bonded to each other such that a cavity is formed therebetween, an internal electrode portion that is formed on the first substrate and housed in the cavity, a piezoelectric vibrating reed that is sealed in the cavity and also is electrically connected to the internal electrode portion in the cavity, an external electrode portion that is formed on an external surface of the first substrate, a through electrode portion that is disposed so as not to be overlapped by the external electrode portion in a thickness direction of the first substrate, while one end of the through electrode portion is electrically connected to the internal electrode portion and another end of the through electrode portion is formed on the external surface of the first substrate while penetrating through the first substrate, and a routing wiring portion that electrically connects the through electrode portion and the external electrode portion.

Piezoelectric vibrator, piezoelectric vibrator mounting body, and piezoelectric vibrator manufacturing method

Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materialshaving different activation temperatures and which are capable of being activated by heating is disposed in the cavity C.

Package, method for manufacturing the same, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

To achieve small-sized formation by shortening a total length after ensuring a length of a base portion capable of sufficiently reducing vibration leakage, there is provided a piezoelectric vibrating pieceincluding a piezoelectric plateincluding a pair of vibrating arm portionsarranged in parallel with each other in a state of being extended in one direction from base ends to front ends, and a base portionhaving connecting portionsrespectively connected to the pair of vibrating arm portions at middle positions from the base ends to the front ends for integrally supporting the pair of vibrating arm portions by way of the connecting portions, exciting electrodesrespectively formed on outer surfaces of the pair of vibrating arm portions for vibrating the pair of vibrating arm portions when a drive voltage is applied thereto, a pair of mount electrodesformed on an outer surface of the base portion and electrically connected respectively to the pair of exciting electrodes, in which at least a portion of the base portion is arranged to be interposed between the pair of vibrating arm portions.

Piezoelectric vibrating piece having arm ends with excitation electrodes of opposite polarity and piezoelectric vibrator, oscillatory, electronic apparatus and radio wave timepiece having same

An electromagnetic-wave shielding device for shielding unnecessary electromagnetic radiation by covering a printed circuit board which generates electromagnetic waves, by a pair of box-like upper and lower shielding cases integrally connected to each other, include an engaged portion provided at a lower shielding case, an engaging portion provided at an upper shielding case of the shielding case pair and engaging with and disengaging from the engaged portion, and pillar-shaped portions being projected from opposing portions of the shielding cases for holding the board between the pillar-shaped portions when the engaged portion of the lower shielding case engages with the engaging portion of the upper shielding case. The printed circuit board held between the pillar-shaped portions is detachably accommodated in the shielding case pair, except for a connect for receiving external signals.

Growing community of inventors

Chiba, Japan

Takeshi Sugiyama