Fujitsu Corporation

Takeshi Soeda

Takashi Yamazaki

Jun Taniguchi

Kazunori Maruyama

An information processing device includes: a memory; and a processor coupled to the memory and configured to: learn a classification rule that classifies an abnormal degree of a production facility from a text feature amount based on the text feature amount obtained from a number of texts included in a plurality of pieces of log data obtained in a predetermined process of the production facility and production history information of the production facility; extract a text feature amount of log data to be monitored obtained in the predetermined process of the production facility; and determine an abnormal degree of the production facility when the log data to be monitored is obtained based on the text feature amount and the classification rule.

Information processing device, production facility monitoring method, and computer-readable recording medium recording production facility monitoring program

A quality determination method includes: in a quality determination space, mapping a quality of a package product in which a plurality of devices are assembled in accordance with a predetermined design condition, with use of each test result of each of the plurality of devices; and determining a quality of the package product, on a basis of mapping result of the mapping.

Quality determination method, quality determination device, quality determination system and computer-readable non-transitory medium

A soft error inspection method for a semiconductor device includes: irradiating and scanning the semiconductor device with a laser beam or an electron beam; and measuring and storing a time of bit inversion for each of areas irradiated with the laser beam or the electron beam of the semiconductor device.

Soft error inspection method, soft error inspection apparatus, and soft error inspection system

A physical properties measuring method includes: acquiring an experimental convergent beam electron diffraction image of a sample by using a transmission electron microscope; calculating Zernike moment intensities of the experimental convergent beam electron diffraction image; and comparing the Zernike moment intensities of the experimental convergent beam electron diffraction image with Zernike moment intensities of calculated convergent beam electron diffraction images calculated on changed physical properties of the sample.

Physical properties measuring method and apparatus

An electron microscope includes an electron gun for generating an electron beam, an accelerator for accelerating the electron beam to apply the electron beam to a sample, a spectroscope for selecting electrons having a specific energy out of the electron beam transmitted through the sample and losing an energy by an interaction with the sample, and a detector for detecting the electrons of the specific energy selected by the spectroscope and giving a transmission signal or a diffraction signal at a depth of the sample corresponding to a lost energy quantity of the electrons.

Electron microscope and observation method

An energy beam is applied to an evaluation region of a sample, a phase distribution image of the energy beam transmitted to the sample in the evaluation region is obtained, and the obtained phase distribution image is analyzed, whereby a stress distribution in the evaluation region is measured. This measuring method measures a stress, based on a phase distribution image, whereby the stress can be measured irrespectively of a crystalline structure of an evaluation sample. A phase distribution image is used, whereby two-dimensional distribution images of the stress, density and refractive index can be obtained.

Stress measuring method and system

A convergent electron beam is incident on an evaluation region of a crystalline material to obtain a HOLZ pattern formed by the convergent electron beam transmitted to the crystalline material (Steps Sto S), a split width of the HOLZ line of the obtained HOLZ pattern is computed (Step S), and a stress in the evaluation region of the crystalline material is evaluated based on the split width of the HOLZ line (Step S). Thus, the stress measuring method and system can measure with good precision a local lattice strain amount and stress value of the crystalline material, and a stress value of a stress source applying a stress to the crystalline material.

A lattice strain measuring method including the steps of: using a scanning transmission electron microscopeto apply convergent electron beamsto a sampleand obtain a convergent-beam electron diffraction imageof the sample; computing a lattice strain magnitude of the sample, based on the obtained convergent-beam electron diffraction image; and displaying the computed lattice strain magnitude, associated with an electron microscope image of the sample. A scanning transmission electron microscopeis used, whereby electron beamsare caused to scan to thereby suitably set an incidence position. Accordingly, the incidence position of the electron beams can be displaced at a nanometer-order pitch accurately in a short period of time. The use of a scanning transmission electron microscoperequires no image forming lens below the sample, and the convergent-beam electron diffraction image is free from the distortion due to the influence of an image forming lens. Thus, a distribution of lattice strains in an electronic device having, e.g., a micronized structure can be displayed in an image with high resolving power and with high accuracy and furthermore in a short period of time.

Lattice strain measuring system and method

According to the invention, a plurality of points in the HOLZ pattern are substituted for a plurality of Hough transform images by means of the Hough transform, according to an image processing of image data that includes a plurality of pixels obtained by opto/electric converting a HOLZ pattern; clusters of the Hough transform images are extracted; and HOLZ lines are then specified by means of reverse transformation of these clusters. Therefore, HOLZ lines can be specified by means of predetermined calculation steps without an arbitrary HOLZ line specification step being performed by a person performing the measurement. It is thus possible to increase the accuracy with which HOLZ lines are specified.

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Kawasaki, Japan

Takeshi Soeda