Denso Corporation

Japan Science and Technology Agency

Nagoya University

Nomura Plating Co., Ltd.

Takeshi Shinoda

Masahito Imai

Hiroaki Tanaka

Yasutoshi Suzuki

Yasuaki Makino

Seiki Aoyama

Tameharu Ohta

Yoshifumi Murakami

Itaru Ishii

Tomohito Kunda

Hideki Murakami

Hajime Kaneko

Ryoichi Ikeo

Keisuke Nakano

Masayuki Mito

Keishi Nanbu

Masahiro Nitta

Osamu Ito

A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20&#xd7;d&#x2266;h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

Physical quantity sensor including bonding wire with vibration isolation performance characteristics

A mold welded with a dissimilar metal member manufactured by pressingly bringing the dissimilar metal member into contact with a mold formed of copper or a copper alloy in a stationary state while rotating the dissimilar metal member at a high speed, stopping the dissimilar metal member, and providing a forced pressure larger than the pressure in the first step to the mold. The present mold solves the problems of efficient cooling and attachment of back frame. Also, a variety of problems including cutting processing loss of copper or copper alloy plate, long processing times, heat distortion and heat deterioration of copper plates, etc, can be solved. Further, welding position precision and welding strength of stud bolts can be improved. Finally, the invention concerns a mold welded with a dissimilar metal member where the mold is manufactured by the first step shown above.

Mold and method of manufacturing the same

A method of producing a connecting rod with a bearing, in which both a process for producing a bearing separately from a connecting rod and a process for assembling the bearing to the connecting rod can be eliminated to reduce processes, labor, and costs to produce the connecting rod. A hollow cylindrical molding of a bearing metal material is inserted and fitted, as an inner member, inside an inner surface of a circular large end hole of a large end section of a connecting rod. A tapered surface of a rotary pressing tool is pressed, while rotating, to the hollow cylindrical molding to heat and soften the hollow cylindrical molding, causing the hollow cylindrical molding of the bearing metal material to plastically flow axially and radially outward, whereby a bearing metal layer is directly joined and formed on the inner surface of the large end hole.

Method of producing connecting rod with bearing

A pressure sensor includes a hollow cylindrical stem, a sensor chip, and a wiring board. The hollow cylindrical stem has a pressure-sensitive flexible diaphragm at a first axial end thereof and an opening at a second axial end thereof, the opening for transmitting pressure into the stem. The sensor chip is provided on the diaphragm for outputting an electrical signal in proportion to the deformation of the diaphragm. The wiring board electrically connects the sensor chip to an external circuit. The wiring board is located around the sensor chip on the first axial end of the stem.

Pressure sensor

A sensor unit sensing a physical quantity comprises a first voltage evaluation circuit, a second voltage evaluation circuit, an alarm signal output circuit, and a sensor output circuit. The first voltage evaluation circuit evaluates a power voltage by comparing it with a reference voltage and outputs an accident signal when the power voltage is lower than a first predetermined voltage. The second voltage evaluation circuit working in a lower voltage range in which the first voltage evaluation circuit is insensitive outputs the accident signal when the power voltage is lower than a second predetermined voltage. The alarm signal output circuit outputs an alarm signal in response to the accident signal. The sensor output circuit outputs a sensor signal and inhibits the circuit from outputting the sensor signal in response to the accident signal, so that the alarm signal output circuit provides the alarm signal in response to the accident signal.

Unit for sensing physical quantity

At least two workpieces are provided and an intermediate member is arranged as a filler between opposed end faces of the workpieces. The workpieces are pressed against each other via the intermediate member to produce friction pressure therebetween while rotating or vibrating the intermediate member at a high speed. Then, each workpiece is upset to the intermediate member on bringing the rotation or the vibration of the intermediate member to a halt. Thus, the workpieces are easily and securely joined without causing any defects.

Friction filler welding

A semiconductor sensor chip mounted on a thin diaphragm of a cylindrical metallic stem via an insulation layer is hermetically contained in a housing of a pressure sensor. The sensor chip includes a strain gage for outputting an electrical signal according to distortion of the diaphragm caused by pressure to be measured. A shield layer is interposed between the insulation layer and the sensor chip, and the shield layer is grounded. Influence of outside noises on the sensor outputs is eliminated or suppressed by the grounded shield layer even if the outside noises are in a high frequency region.

Pressure sensor having semiconductor sensor chip

Magnetic resistive elements,and,cooperatively detect the change of the magnetic field responsive to the rotation of a gear,fixed to a shaft,An amplification circuit,comprises an operational amplifier,having an input terminal to which a gain-determining input resistor,is connected. A gain-determining feedback resistor,is provided in a feedback path of the operational amplifier,The gain-determining resistors,and,are formed by a P well region and a P,region of a MOS process element. The temperature characteristics of the gain-determining resistor,and,are opposed to that of the magnetic resistive elements,and,The temperature characteristics of the gain of the operational amplifier,cancel the temperature characteristics of the magnetic resistive elements,and

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Nagoya, Japan

Takeshi Shinoda