Fanuc Corporation

Takeshi Sawada

Fuyuki Ueno

Kunitaka Komaki

Yuuki Kurokawa

Norihiro Saido

Shinji Akimoto

Makoto Bekke

Yuichi Okochi

Nobuhisa Sugimoto

Norihiro Saidou

Weibo Li

Provided is a printed circuit board for degradation detection, the printed circuit board having an insulator substrate and a wiring pattern for degradation detection, the wiring pattern being formed on an outer surface of the insulator substrate, and the printed circuit board for degradation detection being attached to a main printed circuit board for which degradation is to be detected. The wiring pattern is formed on, of the outer surfaces of the insulator substrate, a back surface positioned on the main printed circuit board side. The insulator substrate has a penetrating part (through hole, notch part) penetrating from the back surface to a front surface positioned on the side opposite from the back surface.

Printed circuit board for degradation detection

A cooling device includes a fan for blowing air to a control board arranged on the downstream side by rotation of a rotator. The cooling device further includes a bypass structure provided so as to avoid the rotator and configured to oil liquid to flow, at least, from the upstream side of the fan to the downstream side of the fan, and a gutter provided on the upstream side of the fan to lead the oil liquid to the bypass structure.

Cooling device

To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.

Printed circuit board

A machining apparatus is provided with a machine learning device that performs machine learning. The machine learning device performs the machine learning by receiving the input of machining accuracy between a machining shape of a workpiece measured on-machine and design data on the workpiece and machining time of the workpiece measured by a measurement device. Based on a result of the machine learning, the machining apparatus changes machining conditions such that the machining accuracy increases and the machining time becomes as short as possible.

Controller-equipped machining apparatus having machining time measurement function and on-machine measurement function

In a printed wiring board on which an electronic component comprising electrode terminal rows on four peripheral sides or two opposite sides thereof is mounted, each of pads at the both ends of pad rows corresponding to the electrode terminal rows extend outwardly relative to the other pads in the direction of arrangement of the pads and has a shape obtained by diagonally cutting a corner located farthest from the center of the electronic component.

Printed wiring board

In a leaded electronic component mounting structure in which the effect of reducing the occurrence of a blow hole is not impaired even if resin of a lead-inserted component is softened by heat during soldering and which can reduce a load placed on a lead when an external force acts, the lead of the lead-inserted component is inserted into a through hole provided in a base material of a printed wiring board, soldering is performed by immersing into molten solder, and a surface mount component and a surface mount component pad form an air vent tunnel. The air vent tunnel does not come into direct contact with the lead-inserted component, and therefore is not blocked even if the resin of the lead-inserted component softens due to soldering. Thus, the effect of reducing the occurrence of a blow hole is not impaired.

Mounting structure of leaded electronic component which reduces occurrence of blow hole

A printed circuit board includes, an insulating substrate, a metal conductor which is formed on the insulating substrate, a solder resist coating a part of the metal conductor, a scooped-out portion of the metal conductor formed in the vicinity of an end of the solder resist, and a metal layer coating the scooped-out portion.

Growing community of inventors

Yamanashi, Japan

Takeshi Sawada