Fuji Corporation

Takeshi Sakurayama

Kota Niwa

Mitsuru Sanji

Hidenori Goto

Kazunori Yamada

A component mounting machine includes an imaging device configured to image a supply position, to which a component is supplied from a component supply device, from above, a component detecting sensor configured to detect the component. A control device acquires component information related to the component supplied by the component supply device when a predetermined determination condition is established. Then the control device selects from multiple processing including first determination processing for determining presence or absence of a component shortage of the component supply device by determining presence or absence of the component at the supply position based on a captured image, and second determination processing for determining presence or absence of a component shortage of the component supply device by detecting the presence or absence of the component at the supply position by the component detecting sensor.

Component mounting machine and component mounting system

An auto loading feeder has a tape guide main body and a peeling blade extending in the conveyance direction with an cutting edge directed towards an upstream side configured to peel off the cover tape from the base tape of the carrier tape which is guided by the tape guide main body. An inspection device for the auto loading feeder includes a height detection sensor configured to output a signal corresponding to a height position of the peeling blade with respect to a reference point on the tape guide main body, and a height discrimination section configured to discriminate whether a height position of the peeling blade with respect to the carrier tape which is being guided by the tape guide main body stays within a predetermined range based on an output signal of the height detection sensor.

Inspection device for auto-loading feeder and electronic component pick and place machine

An information processing device configured to determine a mounting position of a tape feeder to any one of multiple feeder mounting sections formed in a work machine, in which mounting positions of two or more tape feeders configured to supply components of holding target held by two or more holding tools of a work head disposed in the work machine are determined to any one of the multiple feeder mounting sections based on position information indicating supply positions of the two or more tape feeders, so that a difference in an amount of deviation of the supply positions of the two or more tape feeders is within a predetermined range.

Information processing device, work system, and determination method

In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

Component mounting system and component mounting method

The present invention provides a maintenance board that can be used for a maintenance process other than removing static electricity from a component mounting device by being conveyed by a conveyance device of the component mounting device. The maintenance board is conveyed to the conveyance device of the component mounting device. The maintenance board includes at least one of: a brush configured to brush a maintenance target object; a cleaning nozzle configured to be held in an attachable manner to a work head of the component mounting device and to blow air to the maintenance target object; a pressure sensor configured to measure a detachable load of a component to a suction nozzle attached to the work head and a mounting load of a component to a board; and a blower configured to blow air toward the work head.

Maintenance board

A mounting device, comprising: a mounting section on which a feeding unit is installed to supply components by feeding a packaging member where the components are packaged at predetermined intervals; a mounting head configured to pick up a component from the packaging member; an imaging section configured to image the packaging member; and a control section configured to obtain a packaging pitch based on a reference pattern of the packaging member with the packaged components, the reference pattern being acquired based on a pre-pickup image which is a captured image of the packaging member before picking up a component, and a post-pickup image which is a captured image of the packaging member after picking up the component.

Mounting device, detection device, and detection method

A component mounting apparatus includes a nozzle that sucks a component supplied from a feeder, conveys the component to a predetermined position on a substrate, and mounts the component in the predetermined position. The component mounting apparatus controls an XY-robot to perform repeatedly the component mounting operation while performing a thermal correction from a start of the component mounting operation as a result of a power supply being turned on until an amount of positional deviation due to heat from the XY-robot reaches a steady state. After the steady state is achieved, the component mounting apparatus controls the XY-robot to perform repeatedly the component mounting operation while performing a steady state correction using a correction amount resulting immediately after the steady state is achieved without performing the thermal correction and controls the XY-robot to perform a dummy operation for maintaining the steady state during a standby period.

Component mounting apparatus

A dedicated correction value related to the mounting position of an upper surface recognition component with a characteristic section on an upper surface thereof is memorized in correction value folderof an HDD, and when performing mounting work of mounting the upper surface recognition component on a board, a position deviation amount of the characteristic section is acquired based on an image of the upper surface of the upper surface recognition component captured by a mark camera, and the component is mounted at the mounting position based on the acquired position deviation amount and the dedicated correction value. Accordingly, it is possible to mount the specific component at a corrected mounting position such that the position of the characteristic section is appropriate, thereby improving mounting accuracy for the upper surface recognition component.

Machine for performing specified work to a printed circuit board

A component mounting apparatus sets a position that is offset with respect to a suction reference position of a component toward the front side in a feeding direction as a suction position based on a difference between a dimension of the recess-shaped cavity in the Y-direction and a dimension of the component accommodated in the cavity in the Y-direction and sucks the component. Therefore, even if the component in the cavity positionally deviates toward the front side in the feeding direction due to inertia when a carrier tape is stopped, a suction nozzle sucks an appropriate position of the component.

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Nisshin, Japan

Takeshi Sakurayama