Denki Kagaku Kogyo Kabushiki Kaisha

Fuji Xerox Co., Ltd.

Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

Denka Company Limited

Toppan Printing Co., Ltd.

Takeshi Saito

Toru Misaizu

Tomomichi Takatsu

Shigeru Arai

Kazuo Asano

Kouta Matsuo

Noriyuki Sasaki

Kohji Takahashi

Kazuo Suzuki

Hiroshi Uchida

Kenji Hara

Isao Yoneda

Masashi Goto

Hiroki Kitahori

Kenji Tomida

Takenori Atsumi

Tomoki Hiramatsu

Kazuhisa Shishida

Takahisa Okada

Kazuaki Usui

Takashi Terayama

Chikako Sakagami

Daiji Takeuchi

Satoru Kawata

Jyun Sada

Shinji Kaneyuki

Toyoaki Naito

Michio Ueha

Kazunori Shikano

Seiji Saita

Shigeo Kawasaki

An adhesive sheet of the invention includes a substrate and an adhesive composition laminated thereon, the substrate including polyvinyl chloride and a polyester-based plasticizer, wherein the adhesive composition includes two different (meth)acrylate copolymer components (A) and (B) in a mass ratio ranging from 10:90 to 90:10, wherein a content of a cross-linking agent which reacts with functional groups of the component (A) and the component (B) is in a range of 0.5 to 20 mass parts with respect to 100 mass parts of a sum of the component (A) and the component (B), and wherein 10 to 95 mass % of the monomer unit composing the component (A) is 2-ethylhexyl acrylate, and 10 to 95 mass % of the monomer unit composing the component (B) is butyl acrylate.

Adhesive sheet

Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.

Multilayer adhesive sheet and method for manufacturing electronic component

Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.

Method for manufacturing electronic component

Approaches to reducing the natural frequency of a voice coil motor (VCM) in a hard disk drive include configuring one or both of the yokes with at least one mating structure that comprises a step feature that partitions the mating structure into a contact surface and a recessed surface, where the contact surface is toward the outer area of the mating structure and contacts a corresponding mating structure of the other yoke and the recessed surface is toward the inner area of the mating structure and does not contact with the corresponding mating structure of the other yoke. Consequently, the distance between the fixed points is increased, which reduces the natural frequency and thus the resonance of the VCM assembly.

Managing resonance frequency of hard disk drive voice coil motor

A method for manufacturing electronic parts, which is characteristic in that it permits reduction of contamination to the semi-cured adhesive layer formed on semiconductor wafer and the cohesive sheet used therein is superior in adhesiveness for example to the lead frame, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer by coating a pasty adhesive entirely over the rear face of a wafer and curing the pasty adhesive partially by radiation-ray irradiation or heating into the sheet shape, a fixing step of fixing the semi-cured adhesive layer formed on a wafer and a ring frame by bonding them to the cohesive layer of a cohesive sheet, a dicing step of dicing the wafer together with the semi-cured adhesive layer with a dicing blade into semiconductor chips, and a pick-up step of picking up the chips carrying the semi-cured adhesive layer from the cohesive layer of the cohesive sheet after radiation-ray irradiation, wherein the photopolymerization initiator in the cohesive layer of the cohesive sheet has a particular property.

Method for manufacturing electronic parts

An image processing apparatus includes: a reception unit that receives an image in gray-level representation with respect to a pixel; a determination unit that determines a deviation direction of a pixel value of the pixel in the image received by the reception unit; and a processing unit that performs processing on the image received by the reception unit based on the deviation direction determined by the determination unit.

Resolution conversion using deviation direction of a pixel value of an image

In a conventional adhesive sheet laminated with a die attachment film, the die attachment film sometimes drops off from the die chip at the time of pick-up after die chip formation by dicing a wafer. The present invention provides an adhesive including a (meth)acrylate ester polymer, a urethane acrylate oligomer having 4 or more vinyl groups, and silicone microparticles. Another aspect of the invention, provides a process for producing electronic components, the process including: a wafer-pasting step of pasting a wafer on a surface of a die attachment film of an adhesive sheet; a dicing step of dicing the wafer into die chips; and a pick-up step of peeling the die attachment film from the adhesive layer after the dicing step, and picking up the die chip together with the die attachment film.

Adhesive, adhesive sheet, and process for producing electronic components

The objective is to limit pickup defects when chips with a semi-cured adhesive layer are picked up following dicing by lowering the adhesive strength of an ultraviolet curable adhesive beforehand while improving the cohesive force. Provided is a dicing method for semiconductor wafers with a semi-cured adhesive layer that comprises a process to coat the back surface of semiconductor wafers with a paste-like adhesive and semi-cure the paste-like adhesive in a sheet form using heating or ultraviolet irradiation to form a semi-cured adhesive layer, a gluing process to glue an adhesive sheet, wherein an ultraviolet curable adhesive is laminated on a base film, onto the semi-cured adhesive layer, an ultraviolet irradiation process to apply ultraviolet irradiation to the ultraviolet curable adhesive, and a dicing process to dice the semi-cured adhesive layer glued to the adhesive sheet and the semiconductor wafers.

Electronic component manufacturing method

A multi-layered adhesive sheet, includes: a substrate film, an adhesive layerformed by coating an adhesive having a specific composition onto this substrate film, and a die attachment filmlaminated on the adhesive layer. The multi-layered adhesive sheetemploying an adhesive having this specific composition has superior retention of die chipduring the dicing of silicon wafer, allows the die attachment filmand adhesive layerto be easily peeled apart during a pick-up operation of the die chip, and prevents poor adhesion during the bonding of die chipto lead frame

Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part

An image processing apparatus includes a screen processing unit that performs, on a color component basis, screen processing for a color signal having basic color components and at least one spot color component. The screen processing unit performs FM screen processing for one of the basic color components of the color signal and performs AM screen processing for the color components, other than the one of the basic color components, of the color signal with four types of screen angles.

Image processing apparatus for performing AM screen processing and FM screen processing, image processing method, computer-readable medium

Embodiments in accordance with the present invention allow a resin member accommodating therein a trace, to have a small thickness. An HDD according to an embodiment of the present invention includes a resin accommodation member fixed to a side surface of arms. Part of a trace is accommodated in a slit formed in the accommodation member. Accommodating part of the trace in the slit helps suppress fluttering of the trace and improve head positioning accuracy. A corrugated surface structure is formed on each of surfaces of the arms and the accommodation member in abutment with each other. The corrugated surface structure is used to position the accommodation member in a pivot direction. The accommodation member, having the corrugated surface structure for positioning on the surface being fixed, can be made to have a thin wall.

Disk drive apparatus and head assembly using a resin member to accommodate a wire structure

With the invented dicing method, by increasing the cohesive strength while decreasing the adhesive strength of an ultraviolet-curing adhesive in advance, mixing of the ultraviolet-curing adhesive layer of an adhesive sheet with a die attach film on a dicing line can be decreased and pickup failures can be reduced, when picking up chips having a die attach film after dicing. The dicing method for a semiconductor wafer with a die-attach film comprises a first gluing step in which a die attach film is affixed to an adhesive sheet having an ultraviolet-curing adhesive laminated on a base material film, a second gluing step in which a semiconductor wafer is affixed to the opposite side of the die attach film affixed to the adhesive sheet, an ultraviolet irradiation step in which the ultraviolet-curing adhesive is irradiated with ultraviolet light, and a dicing step in which the semiconductor wafer and the die attach film affixed to the adhesive sheet are diced.

Dicing method using a die attach film on an adhesive sheet

An image processor has: a unit that executes a conversion process on input image data represented by pixels of M grayscales (M&#x2267;3), to convert the input data into output image data represented by sub-pixels of two grayscales; and a unit that outputs the output data, wherein the conversion process includes: a process to determine a filling pattern of sub-pixels corresponding to a pixel of interest of the input data according to a corrected grayscale value obtained by adding a correction value to a grayscale value of the pixel of interest; and the pattern includes a core pattern which forms a core of a dot and a growth pattern which grows a dot, the correction value includes a diffused error, and at least a part of the diffused error obtained by weighting an error of a pixel determined as the core pattern is not included in the correction value.

Image processor, image-processing method, and computer-readable medium

A disk drive. The disk drive includes a head, a moving mechanism, a first peak filter, an adaptive peak filter, and a filter controller. The head is configured to read servo data on a disk at sampling frequency. The moving mechanism is configured to move the head in proximity with a recording surface of the disk. The first peak filter has a fixed peak frequency and a variable gain, and is configured to be inserted into a servo loop. The servo loop is configured to position the head with position error signals between servo data read by the head and a target position. The adaptive peak filter has a variable peak frequency and a variable gain, and is configured to be inserted into the servo loop. The filter controller is configured to control the gain of the adaptive peak filter according to the gain of the first peak filter.

Disk drive and method for head servo control of the disk drive

An image processing apparatus includes: an acceptance section; an edge detection section; and a screen processing section, wherein the edge detection section includes: a first edge determination section that subjects a pixel of interest to edge determination by reference to information about a density of the pixel of interest and information about densities of pixels around the pixel of interest determined by an edge detection window; and a second edge determination section that compares minimum density information among the information about densities of pixels determined by the edge detection window with a predetermined background threshold value, and that redetermines the pixel of interest, which is determined to belong to an edge portion by the first edge determination section, as belonging to anon-edge portion in cases where the minimum density is equal to or greater than the background threshold value.

Growing community of inventors

Kanagawa, Japan

Takeshi Saito