Hitachi, Ltd.

Takeshi Oyamada

Shigeru Kobayashi

Masao Sakata

Osamu Kasahara

Hidetsugu Ogishi

Tsuneaki Kamei

Katsuo Abe

Hideaki Shimamura

Tamotsu Shimizu

Hikaru Nishijima

A conical-frustum-sputtering target for use in a magnetron sputtering apparatus for forming a film on a planar substrate. The sputtering target includes a target member having at least a conical-frustum-shaped surface including a first surface portion parallel to a center portion of the planar substrate and spaced a first distance therefrom, a second surface portion parallel to at least an extension of a peripheral portion of the planar substrate and being spaced a second distance therefrom wherein the second distance is less than the first distance, and at least one-third surface portion inclined with respect to the planar substrate for interconnecting the first surface portion and the second surface portion. By utilizing such a sputtering target, a film having a uniform thickness can be formed on a substrate having side steps and such can be utilized to deposit metallic thin film for a minute wiring pattern and can be applied to a larger substrate.

Conical-frustum sputtering target and magnetron sputtering apparatus

A sputtering target structure suitable for use with a planar magnetron sputtering electrode device has a plurality of annular target members arranged concentrically. The annular target member is provided with either an annular groove for concentration of an electric field or an annular wall for repelling electrons.

Target for sputtering

Growing community of inventors

Takasaki, Japan

Takeshi Oyamada