Tdk Corporation

Takeshi Oohashi

Takashi Ohtsuka

Hajime Kuwajima

Yuichiro Okuyama

Kenichi Yoshida

Kazuhiro Yoshikawa

Yasumasa Harihara

Tomonaga Nishikawa

Kenji Endo

Hideya Matsubara

Masaki Matsushima

Toshiyasu Fujiwara

Naoki Sotoma

Manabu Yamatani

Shinichiro Toda

Chengbin Lin

Yukio Mitake

Naoaki Utagawa

Manabu Kitami

Daiki Kusunoki

A band-pass filter includes a first inductor and a second inductor electromagnetically coupled to each other, a first ground terminal electrically connected to the first inductor, a second ground terminal electrically connected to the second inductor, and a stack for integrating the first inductor, the second inductor, the first ground terminal, and the second ground terminal. The first ground terminal and the second ground terminal are each connected to a ground and are not electrically connected to each other in the stack.

Multilayer band-pass filter

Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the same

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Electronic component and its manufacturing method

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Electronic component

Disclosed herein is a directional coupler that includes a main line configured to transmit a high-frequency signal, a sub line electromagnetically coupled to the main line, and a ground pattern positioned at least partially between the main line and the sub line in a plan view. The sub line includes a low pass filter having an inductance pattern and a capacitor. The ground pattern has an opening that overlaps at least the inductance pattern in a plan view.

Directional coupler and wireless communication device using the same

Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

Multilayer wiring structure and its manufacturing method

A directional coupler including a main line having an input terminal and an output terminal, and a sub-line having a coupling terminal and an isolation terminal, the main line, the sub-line, the input terminal, the output terminal, the coupling terminal and the isolation terminal being disposed within a laminate, wherein the main line and the sub-line extend in a loop shape in parallel with and spaced apart from each other by a gap such that electromagnetic coupling is generated therebetween and such that the main line is positioned outside the sub-line on a coupling layer, the input terminal, the output terminal, the coupling terminal and the isolation terminal are disposed outside the main line, and the main line is interposed between the output terminal and the sub-line.

Directional coupler and wireless communication device

An antenna device includes an antenna elementand a printed circuit boardon which the antenna elementis mounted. The antenna elementincludes a basewhich is made of a dielectric material and a radiation conductor formed on at least one surface of the base. The printed circuit boardincludes ground clearance regionhaving substantially a rectangular shape and having one side contacting an edge of the printed circuit board and other three sides surrounded by an edge line of a ground pattern, an antenna mounting regionprovided within the ground clearance region, and at least one frequency adjusting elementprovided within the ground clearance region. The frequency adjusting elementis provided on the far side of the antenna mounting regionas viewed from an edgeof the printed circuit board

Antenna apparatus and wireless communication device using same

A surface mount antenna with small size and broadband is provided. The surface mount antenna includes: a substrate including a dielectric material or a magnetic material as a main material; a feed radiation conductor formed on the substrate, one end of the feed radiation conductor being a first feed end to be supplied with power, and the other end being a first open end; and a parasitic radiation conductor formed on the substrate at a distance from the feed radiation conductor, one end of the parasitic radiation conductor being a second feed end to be supplied with power from the feed radiation conductor through electromagnetic coupling, and the other end being a second open end. A region having a dielectric constant or a magnetic permeability lower than that of the main material of the substrate is provided between the feed radiation conductor and the parasitic radiation conductor.

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Tokyo, Japan

Takeshi Oohashi