Texas Instruments Corporation

Takeshi Onogami

Kengo Aoya

Masamitsu Matsuura

Hideaki Matsunaga

A semiconductor package includes a semiconductor die including an active side, a redistribution layer over the active side of the semiconductor die, the redistribution layer including metal traces electrically connecting die pads on the active side of the semiconductor die to electrical contacts on an external surface of the semiconductor package, and a layered mold covering the semiconductor die opposite the redistribution layer. The layered mold includes a first resin layer adjacent to the redistribution layer, a fiber layer adjacent to the first resin layer and opposite the redistribution layer, and a second resin layer adjacent to the fiber layer and opposite the redistribution layer. A coefficient of thermal expansion (CTE) of the first resin layer is substantially different than a CTE of the second resin layer.

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Oita, Japan

Takeshi Onogami