Nippon Pillar Packing Co., Ltd.

Fujitsu Ten Limited

Takeshi Okunaga

Akira Nakatsu

Eisuke Hayakawa

Hiroaki Yoshitake

Kenpei Yamasaki

Tomoki Hayashi

Manami Noda

Takaaki Fujita

Miyuki Kobayashi

Tatsuya Tamaki

Naozumi Fukushima

Kojiro Iwasa

Yusuke Natsuhara

To improve electric characteristics of a dielectric for use for a high frequency band. A dielectricformed by lamination of fluorine resin includes a base main layercontaining a base materialand made of melting fluorine resin, a pair of base cover layersmade of melting fluorine resin and formed on both surfaces of the base main layer, and a pair of functional layersmade of fluorine resin mixed with hollow fillersand laminated on the outer surfaces of the base cover layers

Dielectric, copper clad laminate, circuit board, method for manufacturing copper clad laminate

A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.

Circuit board and method for manufacturing the same

A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.

Method for producing high frequency circuit board, and high frequency circuit board

[Object] To improve the directional characteristics of a planar antenna for a milliwave band as well as widening a bandwidth. [Means for Settlement] A feed linehas a main feed line, two sub-feed lines, and a distributor Sadapted to branch the main feed lineinto the two sub-feed lines. The distributor Sincludes: two outer edgesL andR formed as curved lines connecting both side edgesL andR of the main feed lineto first edgesof the sub-feed lines; and an inner edgeconnecting second edgesof the sub-feed linesto each other, in which the inner edgeis configured to include two inner curved linesL andR that are convex in mutual directions, and has a pointed shape that is concave toward the main feed lineside.

Planar antenna

Provided is a distributor capable of reducing insertion loss while suppressing a ratio in power distribution among output lines from being changed. The distributoris a distributor that is connected with an input line Lin and output lines Loto Lorespectively formed on a dielectric substrateas microstrip lines, and distributes to the output lines Loto Lohigh frequency power fed from a feeding point to a branching point through the input line Lin. In addition, the distributoris configured to include a stub areathat is formed in the input line Lin, is separated from the branching point, and has a rectangular shape wider than line widths of a first area La and a second area Lb of the input line Lin. The stub areais arranged in a position where the distance dbetween an edge on the feeding point side and lateral edgeson an input side of the output lines Loand Losubstantially perpendicular to the input line Lin is substantially equal to (&#x3bb;g/4)&#xd7;(2n+1) where &#x3bb;g is a guide wavelength and n is an integer.

Distributor and planar antenna

In an antenna, an antenna element interval is reduced without depending on an interval between converters, to widen the range of a phase folding angle to widen a detection angle range. The antenna includes a first antenna element including a feeder line extending from a first converter and a plurality of radiating elements. A second antenna element includes a feeder line extending from a second converter aligned together with the first converter and a plurality of radiating elements. The first and second antenna elements respectively include, at partial line portions of the feeder lines which extend from the converters to closest radiating elements, bend portions which are bent in directions which the bend portions come close to each other. The partial line portions of the first and second antenna elements are disposed so as to be linearly symmetrical about a virtual line.

Antenna

An antenna device according to an embodiment includes a dielectric substrate, a housing, and an interference prevention unit. On the top surface side of the dielectric substrate, a plurality of antennas is formed, and on the bottom surface side, a ground is formed, each as a conductive thin film pattern, respectively. The housing is formed of a conductive material, and formed to have a shape configured to function as a waveguide, and the top surface side of the housing is bonded to the bottom surface side of the dielectric substrate. The interference prevention unit is formed between the neighboring antennas to include at least a groove provided on the top surface side of the housing and a slit provided on the ground in the portion corresponding to the groove.

Antenna device and radar device

An antenna which reduces the number of end faces and perpendicular corners, and suffers from little deterioration of performance even if used for high frequency transmission/reception, in particular a microstrip patch antenna which is comprised of a dielectric substrate on the bottom surface of which a conductive ground plate is formed and on the top surface of which a patch antenna part formed by a conductor and a feeder circuit connected to the same are provided, wherein the feeder circuit is connected to the antenna part while offset by exactly a predetermined distance to either end side from a center of one side of said antennas part to which said feeder circuit is to be connected so that a transmission loss of the antenna becomes a predetermined value or less. The predetermined distance can be made 20 to 70% of the longitudinal side of the patch antenna part.

Growing community of inventors

Osaka, Japan

Takeshi Okunaga