Tdk Corporation

Takeshi Okumura

Tomokazu Ito

Tomonaga Nishikawa

Makoto Yoshida

Toshio Tomonari

Hiroshi Kamiyama

Kouji Kawamura

Hidenori Tsutsui

Takashi Nakagawa

Sho Nakagomi

Toshihiro Kuroshima

Tadashi Watanabe

Tsuneo Kuwahara

Katsumi Saito

Hiroshi Suzuki

Hiromu Sakamoto

Kengo Osada

Takuro Tsuruta

Tatsuya Karakame

Eizou Hara

Yuichiro Igarashi

Disclosed herein is a coil component that includes first, second, third, and fourth terminal electrodes; a first planar spiral coil formed on a substrate, the first planar spiral coil having an outer peripheral end connected to the first terminal electrode; a second planar spiral coil stacked on the first planar spiral coil through a first insulating layer, the second planar spiral coil having an outer peripheral end connected to the second terminal electrode; and first and second lead-out patterns stacked on the second planar spiral coil through a second insulating layer. The first lead-out pattern connects the third terminal electrode and an inner peripheral end of the first planar spiral coil. The second lead-out pattern connects the fourth terminal electrode and an inner peripheral end of the second planar spiral coil. The second insulating layer is thicker than the first insulating layer.

Coil component

Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.

Disclosed herein is a coil component that includes first and second magnetic members; a coil layer arranged between the first and second magnetic members, the coil layer including a plurality of conductor layers and a plurality of non-magnetic insulating layers, the conductor layers and the non-magnetic insulating layers being alternately laminated, the conductor layers being connected to each other via through holes formed in the non-magnetic insulating layers to form a coil pattern; a first external terminal covering one end of the coil pattern exposed to at least one of side surfaces of the coil layer without covering the first and second magnetic members; and a second external terminal covering other end of the coil pattern exposed to at least one of the side surfaces of the coil layer without covering the first and second magnetic members.

Coil component, manufacturing method thereof, and circuit board on which coil component are mounted

A common mode filter is provided with first and second spiral patterns provided on an insulating layer and connected to each other in series, and third and fourth spiral patterns provided on an insulating layer and connected to each other in series. The first and third spiral patterns overlap each other so as to be magnetically coupled with each other. The second and fourth spiral patterns overlap each other so as to be magnetically coupled with each other. Relationships between winding directions of the first and second spiral patterns and between winding directions of the third and fourth spiral patterns are set to cancel out magnetic fluxes of the couples of the spiral patterns each other, respectively. Each number of turns in the first and third spiral patterns is larger than each number of turns in the second and fourth spiral patterns respectively.

Common mode filter

An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.

Electronic component

A common mode noise filter includes: a common mode filter inserted into a pair of signal lines; and a pair of capacitively coupled coils having one ends connected respectively to the corresponding signal lines and the other ends opened. According to the present invention, common mode noise can be removed by a common mode filter, as well as, differential mode noise in a desired frequency band can be removed by a pair of coils whose other ends are opened.

Common mode noise filter

Disclosed herein is a coil component that includes an insulating layer formed on a substrate, a coil conductor provided between the substrate and the insulting layer, a first electrode connected to one end of the coil conductor, a second electrode connected to the other end of the coil conductor, and a magnetic layer formed on the insulting layer so as to cover a side surface of each of the first and second electrodes without covering a top surface of each of the first and second electrodes.

Coil component and method of manufacturing the same

A coil componentis provided with a substrate, a thin-film coil layerprovided on the substrate, first and second bump electrodesprovided on a surface of the thin-film coil layer, a first lead conductorprovided on the surface of the thin-film coil layertogether with the first and second bump electrodesand formed integrally with the first bump electrode, and an insulator layerprovided between the first bump electrodeand the second bump electrode. The thin-film coil layercontains a first spiral conductorwhich is a plane coil pattern. The first bump electrodeis connected to an internal peripheral end of the first spiral conductorvia the first lead conductor. The second bump electrodeis connected to an external peripheral end of the first spiral conductor

A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode.

A common mode choke coil is provided with first and second coil conductors that are magnetically coupled to each other, a third coil conductor that is electrically connected in series to the first coil conductor and substantially not magnetically coupled to the first coil conductor, a fourth coil conductor that is electrically connected in series to the second coil conductor and substantially not magnetically coupled to the second coil conductor, a first contact conductor for connecting the third coil conductor with the inner end of the first coil conductor, and a second contact conductor for connecting the fourth coil conductor with the inner end of the second coil conductor. The third coil conductor and the fourth coil conductor are substantially not magnetically coupled, and are in a linear symmetrical relationship based on a prescribed center line.

Common mode choke coil

A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filterhas the three-layered structure including a first coil layera second coil layerand a lead layerA first planar coiland a second planar coilof a substantially circular spiral shape are formed in the first and second coil layersrespectively. A first lead wireand a second lead wireformed in a lead layerhave a first straight portionc and a second straight portionc, respectively. The first straight portionc is located on a straight line Lperpendicular to a plurality of first tangent lines to spiralsat a plurality of respective intersection points with the spirals. The second straight portionc is located on a straight line Lperpendicular to a plurality of second tangent lines to the spiralsat a plurality of respective intersection points with the spirals

A common mode choke coil includes two laminated coil conductors, a first magnetic substrate arranged on one of the coil conductors, and a second magnetic substrate arranged on the other coil conductor. When it is assumed that a distance from a conductor center of the one coil conductor to the surface of the first magnetic substrate is designated as A, a distance from a conductor center of the other coil conductor to the surface of the second magnetic substrate is designated as B, and a distance from the conductor center of the one coil conductor to the conductor center of the other coil conductor is designated as C, C&#x3c;(A+B)/2 is satisfied. Accordingly, because a difference in the distances between the magnetic substrates and the coil conductors becomes relatively small, a leakage inductance due to the difference in the distance decreases, and the cut-off frequency with respect to a differential mode signal can be increased.

A common-mode filter comprises a first conductor layer, a second conductor layer, and an insulating layer placed between the first and second conductor layers. The first conductor layer has a first spiral part formed such as to draw a convolution and a first lead electrode extending from one end of the first spiral part. The second conductor layer has a second spiral part formed such as to draw a convolution and a second lead electrode extending from one end of the second spiral part. The first conductor layer is formed with third and fourth lead electrodes. The second conductor layer is formed with a connecting conductor connecting the third lead electrode to the other end of the first spiral part. The fourth lead electrode is connected to the other end of the second spiral part through a contact hole formed in the insulating layer. The third lead electrode is connected to one end of the connecting conductor through a contact hole formed in the insulating layer. The other end of the connecting conductor is connected to the other end of the first spiral part through a contact hole formed in the insulating layer.

Common-mode filter

A coil assembly for reducing variations in characteristic impedance includes a winding section having a first surface and a second surface on the opposite side of the winding section from the first surface, a plurality of first protrusions provided on the first surface, and a plurality of second protrusions provided on the second surface. These protrusions are identical in shape to each other and are arrayed linearly on their respective surfaces so that the first protrusions are offset from the second protrusions. Two conducting wires are wound between neighboring protrusions such that one wire contacts one of the neighboring protrusions, while the other wire contacts the other neighboring protrusion.

Coil assembly including common-mode choke coil

A common-mode choke coil comprises an insulating layer and first and second coil conductors. The first and second coil conductors are laminated with the insulating layer interposed therebetween and are magnetically coupled to each other. A width W (mm) and a length L (mm) of at least one coil conductor in the first and second coil conductors satisfy the relational expression of:&#x221a;{square root over ()}&#x3c;(7.6651&#x2212;)/0.1385where fc (MHz) is the cutoff frequency with respect to differential-mode noise.

Growing community of inventors

Tokyo, Japan

Takeshi Okumura